XC7Z045-L2FFG900I

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Low-Power Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z045-L2FFG900IZynq-7000 SoC27.325,00-2,00350,00020090880340~0.95–1.0 VSurface mount−40 °C ~ +100 °CFCBGA-900900-FCBGA (31×31 mm)