XC7Z045-3FBG676E

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +100°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z045-3FBG676EZynq-7000 SoC27,33-3,00~350,000 LE192000002501.0 VSMD/SMT0 °C ~ +100 °CFCBGA-676FCBGA-676