XC7Z045-1FFG676I

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z045-1FFG676IZynq-7000 SoC0,00-1,00350,000 LE19,200,0002120.97 – 1.03 VSurface mount−40 °C — 100 °CFFG/FBG-676676-FCBGA (27×27 mm)