XC7Z030-1FFG676C

Manufacturer: Xilinx
Logic Cells: 125,000
Logic Slices: 17,600
Embedded RAM (eRAM): 9,360 Kb (260 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

SEND US A MESSAGE

    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z030-1FFG676CZynq-7000 SoC19,65-1,00~125,000 LE93000002501.0 VSMD/SMT0 °C … 85 °CFCBGA-676FCBGA-676