XC7K70T-2FBG676C

Manufacturer: Xilinx
Logic Cells: 74,880
Logic Slices: 11,700
Embedded RAM (eRAM): 4,860 Kb (135 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K70T-2FBG676CKintex-75.125,00-2,0065,60049766403000.97 ~ 1.03Surface Mount0 °C ~ 85 °C (C)676-FCBGA676-FCBGA (27×27)