XC7K410T-2FBG676I

Manufacturer: Xilinx
Logic Cells: 410,000
Logic Slices: 64,800
Embedded RAM (eRAM): 18,432 Kb
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K410T-2FBG676IKintex-731.775,00-2,00406,720293068804000.97 ~ 1.03Surface Mount−40 °C ~ 100 °C (I)676-FCBGA676-FCBGA (27×27)