XC7K325T-2FFG900I

Manufacturer: Xilinx
Logic Cells: 326,080
Logic Slices: 51,200
Embedded RAM (eRAM): 12,288 Kb
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K325T-2FFG900IKintex-725.475,00-2,00326,080164044805000.97 V ~ 1.03 VSurface Mount-40 °C ~ +100 °C (I)900-FCBGA (FFG900)900-FCBGA (31×31)