XC7K160T-2FFG676I

Manufacturer: Xilinx
Logic Cells: 160,000
Logic Slices: 25,600
Embedded RAM (eRAM): 4,320 Kb
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K160T-2FFG676IKintex-712.675,00-2,00162,240119808004000.97 – 1.03 VSurface mount−40 °C — 100 °C676-BBGA, FCBGA676-FCBGA (27×27)