XC7K160T-1FBG676C

Manufacturer: Xilinx
Logic Cells: 162,240
Logic Slices: 25,350
Embedded RAM (eRAM): 11,700 Kb (325 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K160T-1FBG676CKintex-712.675,00-1,00162,240119808004000.97 – 1.03 V (typ 1.0 V)Surface mount0 °C — 85 °C676-FBGA/FCBGA676-FCBGA (27×27)