XC7A200T-1FBG676I

Manufacturer: Xilinx
Logic Cells: 215,360
Logic Slices: 33,920
Embedded RAM (eRAM): 13,140 Kb
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7A200T-1FBG676IArtix-7-1,0016.825,00215,360134553604000.95 – 1.05 VSurface mount−40°C – +100°C (I)FCBGA-676676-FCBGA