XC5VLX50-2FFG676I

Manufacturer: Xilinx Logic Cells: 51,840 Logic Slices: 8,160 Embedded RAM (eRAM): 2,448 Kb (136 × 18Kb Block RAM) Package: FFG676 (Flip-Chip BGA) Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX50-2FFG676IVirtex-5 LX3,60-2,004608017694724400.95 V – 1.05 VSurface Mount-40 °C – +100 °C (I)676-FBGA / FCBGA676-FCBGA (≈27 × 27 mm)