XC5VLX50-2FFG676C

Manufacturer: Xilinx Logic Cells: 51,840 Logic Slices: 8,160 Embedded RAM (eRAM): 2,448 Kb (136 × 18Kb Block RAM) Package: FFG676 (Flip-Chip BGA) Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX50-2FFG676CVirtex-5 LX3,60-2,004608017694724400.95 V – 1.05 VSurface Mount0 °C – +85 °C (C)676-FBGA / FCBGA676-FCBGA (≈27 × 27 mm)

    A high-speed commercial FPGA designed for applications requiring better timing performance without industrial temperature requirements.

    Key Features

    • Faster speed grade (-2)
    • Optimized cost-performance
    • Reliable operation

    Technical Specifications

    • Package: FFG676
    • Speed Grade: -2
    • Temperature: 0°C to +85°C

    Cross Reference

    • XC5VLX50-1FFG676C
    • XC5VLX50-2FFG676I

    Applications

    • Data processing
    • Networking devices
    • Embedded systems

    Stock Availability

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