XC7K325T-2FFG900I | Xilinx Kintex-7 High-density Industrial FPGA Inventory Update, Quotation & Cross Migration Solutions
XC7K325T-2FFG900I is a high-density mid-to-high-end FPGA of Xilinx Kintex-7 family, rich in logic units, DSP computing resources and multi-channel high-speed GTX transceivers, industrial temperature grade, FCBGA900 large packaging. It is the core chip for high-speed data acquisition equipment, medical CT signal processing boards, aerospace communication testing devices and industrial high-precision vision inspection systems.
Although AMD extends the lifecycle of all 7 Series FPGAs to 2035, 28nm wafer capacity is occupied by Versal AI chips in large quantities. The factory lead time of XC7K325T has been extended to 28–40 weeks, and high-density models are the most scarce in the whole product line.
LXBCHIP reserves more than 2100 pieces of genuine original XC7K325T-2FFG900I sealed tray inventory with full serial number traceability.
Tiered Unit Price (USD)
1 ~ 15 pcs:
$245.6 / pc
16 ~ 199 pcs: $218.2 / pc
≥ 200 pcs: Negotiable long-term cooperative price
Replacement Models
- Pin-Compatible Upgrade Version: XC7K410T-2FFG900I, expanded logic and transceiver resources
- Cost Reduction Alternative: XC7K160T-2FFG900I, suitable for medium-speed signal processing projects
Application Scenarios
Medical imaging equipment, aerospace signal test module, industrial high-speed data recorder, optical fiber communication gateway
결론
High-density Kintex-7 FPGAs are difficult to obtain through official factory orders. Hardware teams can rely on our spot inventory to ensure project progress. Our technical team provides free PCB and firmware migration guidance.
