| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU5P-3SFVB784E | 킨텍스® 울트라스케일+ | 23,00 | -3,00 | 474,600 LE | 41,984,000비트 | 0 | 0.850 V | 표면 실장 | 0°C - 100°C | FCBGA-784 | 784-FCBGA |
사양
부품 번호 정의
This is AMD Xilinx Kintex UltraScale+ FPGA based on 16nm FinFET process, focused on low-power embedded signal processing, portable measurement equipment and edge computing applications.
- XCKU5P: Mid-range low-power chip of Kintex UltraScale+ family
- -3: Speed Grade 3, power-saving optimized timing grade, prioritizes low power consumption rather than maximum working frequency
- SFVB784: 784-ball compact flip-chip FCBGA package
- E: Extended industrial temperature grade, junction temperature range: -40°C ~ +125°C
On-Chip Hardware Resources
Logic and DSP Computing Resources
- Total Logic Cells: 331,680
- DSP48E2 arithmetic blocks: 1824 units
Mainly applied to FFT operations, digital filtering, wireless baseband preprocessing, image algorithm acceleration and medium-scale matrix calculation
On-Board Embedded Memory
- Total Block RAM capacity: 20.6 Mb
Constructed by independent 36K dual-port RAM modules for large data buffering, FIFO queue and intermediate algorithm data storage
LUT-based distributed RAM is used for ultra-low latency small-capacity temporary caching
Clock Management System
Multiple MMCM and PLL clock management tiles are integrated on chip. It supports clock multiplication, division, arbitrary phase shifting and clock jitter suppression to meet the timing requirements of multi-clock complex digital systems
High-Speed Transceivers & General I/O Interfaces
- 8-channel GTH high-speed serial transceivers, maximum single-lane rate up to 16.375 Gbps
Compatible protocols: PCIe Gen3, 10G Ethernet, JESD204B/C, Aurora serial transmission
- Available user I/O pins: 324
Equipped with HR wide voltage range I/O banks and HP high-performance I/O banks, supporting LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
- Built-in SYSMON system monitoring module: Real-time acquisition of chip internal temperature, each group power supply voltage and external analog input signals
Power Supply Parameters
Nominal core logic voltage: 0.85 V
Independent power domains are set for core logic, block RAM, transceivers and I/O parts. Dynamic voltage and frequency scaling can be enabled to reduce power consumption under light load conditions
Typical overall power consumption: 12W ~ 32W, passive heat sink cooling is available for miniature embedded devices
Packaging and SMT Assembly Specifications
- Package: 784-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering work must be finished within 168 hours after vacuum packaging is unsealed
- Lead-free structure, fully compliant with RoHS environmental directives
- Packed in anti-static trays for automated industrial PCB mass production
Environmental Reliability Performance
Capable of stable long-term operation under extreme temperature variation and strong electromagnetic interference environments.
It supports 256-bit AES bitstream encryption for design IP protection, SEU single-event upset correction and partial dynamic reconfiguration, meeting high reliability demands of vehicle electronics, outdoor industrial equipment and portable airborne terminals.
일반적인 애플리케이션 시나리오
- Portable software-defined radio, compact wireless communication baseband signal processing modules
- Embedded multi-channel machine vision devices, portable industrial visual inspection terminals
- Handheld spectrum analyzers, multi-channel vibration data recorders and portable precision test instruments
- Miniature radar front-end signal acquisition and echo processing boards
- Vehicle-mounted intelligent perception auxiliary modules and in-vehicle video processing units
- Medium-speed PCIe high-speed data acquisition cards and custom embedded core carrier boards
