| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-10SFG363I | Virtex-4 SX | 0,00 | -10,00 | — | — | 240 | 1.14V ~ 1.26V | 표면 실장 | — | 363-FBGA, FCBGA | 363-FCBGA(17×17) |
XC4VLX25-10SFG363I: Industrial-Grade Virtex-4 LX in Compact SF363 Package
그리고 XC4VLX25-10SFG363I provides 24,192 logic cells in a compact 17mm x 17mm footprint. Designed for industrial applications where PCB real estate is limited but environmental resilience is mandatory, this FPGA bridges the gap between high-density logic and small-form-factor design.
The combination of the 산업용 온도 등급 and the -10 속도 등급 makes this part particularly suitable for long-term deployments in outdoor telecommunications, rail signaling, and ruggedized industrial automation where reliability is prioritized over raw clock speed.
핵심 기술 사양
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로직 셀: 24,192
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CLB 배열: 48 x 72
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총 블록 RAM: 1,296 Kb
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DSP48 슬라이스: 48
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사용자 I/O: 240 (Max)
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패키지: SFG363 (Fine-pitch BGA, 0.8mm pitch, Lead-Free)
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속도 등급: -10
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온도 등급: 산업 ($-40°C$ 에 $+100°C$ $T_j$)
하드웨어 설계 시 고려 사항
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0.8mm Pitch Layout: Unlike the more common 1.0mm pitch BGAs, the SFG363 requires tighter tolerances. When routing the 240 I/Os, ensure your PCB stack-up allows for the necessary escape routing without compromising signal integrity on high-speed differential pairs.
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Power-On Current ($I_{CCINT}$): The Virtex-4 architecture is known for a specific power-on surge. While the -10 speed grade is more efficient than the higher-binned versions, you must still ensure your $V_{CCINT}$ (1.2V) regulator can handle the peak startup current as specified in the Xilinx DS302 datasheet.
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열 관리: The small 17mm footprint concentrates heat more than the larger 668-pin packages. In industrial environments with restricted airflow, we recommend a junction temperature analysis to ensure the $100°C$ limit is not exceeded during high-toggle-rate operations.
Tooling & Maintenance Note
The XC4VLX25-10SFG363I is a mature product. It is 자일링스 비바도에서 지원되지 않음. All development, synthesis, and bitstream generation must be conducted using 자일링스 ISE 디자인 스위트 14.7. For engineers maintaining legacy systems, it is critical to keep an archive of the original .ucf constraints file, as the SF363 package has a significantly different pin-mapping compared to the FFG668.
비교: XC4VLX25 SFG363 대 FFG668
| 매개변수 | XC4VLX25-10SFG363I | XC4VLX25-10FFG668I |
| Footprint Size | 17mm x 17mm | 27mm x 27mm |
| 볼 피치 | 0.8mm | 1.0mm |
| Available I/O | 240 | 448 |
| BRAM / DSP | 1,296 Kb / 48 | 1,296 Kb / 48 |
엔지니어링 FAQ
Is the -10SFG363I a drop-in replacement for the -10SFG363C?
Yes. The Industrial ‘I’ grade is a “better-than” replacement for the Commercial ‘C’ grade. It offers an expanded temperature range ($-40°C$ 에 $+100°C$) while maintaining identical electrical and timing characteristics within the standard commercial window.
Why is this part in a “G” package?
The “G” signifies that the SF363 package is Lead-Free (RoHS compliant). This is essential for modern MRO (Maintenance, Repair, and Operations) to comply with environmental regulations without changing the original hardware design.
How do you ensure the quality of these mature-market parts?
We understand that sourcing Virtex-4 parts in 2026 requires diligence. We provide full visual inspection, marking verification, and can provide X-ray analysis or solderability testing upon request to ensure the integrity of our stock.
Need a technical datasheet or a quote for a specific Date Code?
Maintaining legacy hardware shouldn’t be a gamble. We provide traceable, high-reliability silicon for mission-critical systems.
Would you like me to pull the specific power-on sequence requirements or the IBIS models for this SF363 package?
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