XC4VLX25-10SFG363I

XC4VLX25-10SFG363I: Industrial-Grade Virtex-4 LX in Compact SF363 Package

The XC4VLX25-10SFG363I provides 24,192 logic cells in a compact 17mm x 17mm footprint. Designed for industrial applications where PCB real estate is limited but environmental resilience is mandatory, this FPGA bridges the gap between high-density logic and small-form-factor design.

The combination of the Peringkat suhu industri and the -10 tingkat kecepatan makes this part particularly suitable for long-term deployments in outdoor telecommunications, rail signaling, and ruggedized industrial automation where reliability is prioritized over raw clock speed.

Spesifikasi Teknis Inti

• Sel Logika: 24,192

• Array CLB: 48 x 72

• Total Blok RAM: 1.296 Kb

• Irisan DSP48: 48

• I/O Pengguna: 240 (Max)

• Paket: SFG363 (Fine-pitch BGA, 0.8mm pitch, Lead-Free)

• Tingkat Kecepatan: -10

• Tingkat Suhu: Industri ($-40 ° C$ untuk $ + 100 ° C$ $T_j$)

Hardware Design Considerations

• 0.8mm Pitch Layout: Unlike the more common 1.0mm pitch BGAs, the SFG363 requires tighter tolerances. When routing the 240 I/Os, ensure your PCB stack-up allows for the necessary escape routing without compromising signal integrity on high-speed differential pairs.

• Power-On Current ($I_{CCINT}$): The Virtex-4 architecture is known for a specific power-on surge. While the -10 speed grade is more efficient than the higher-binned versions, you must still ensure your $V_{CCINT}$ (1.2V) regulator can handle the peak startup current as specified in the Xilinx DS302 datasheet.

• Manajemen Termal: The small 17mm footprint concentrates heat more than the larger 668-pin packages. In industrial environments with restricted airflow, we recommend a junction temperature analysis to ensure the $100 ° C$ limit is not exceeded during high-toggle-rate operations.

Tooling & Maintenance Note

The XC4VLX25-10SFG363I is a mature product. It is not supported by Xilinx Vivado. All development, synthesis, and bitstream generation must be conducted using Xilinx ISE Design Suite 14.7. For engineers maintaining legacy systems, it is critical to keep an archive of the original .ucf constraints file, as the SF363 package has a significantly different pin-mapping compared to the FFG668.

Comparison: XC4VLX25 SFG363 vs. FFG668

Engineering FAQ

Is the -10SFG363I a drop-in replacement for the -10SFG363C?

Yes. The Industrial ‘I’ grade is a “better-than” replacement for the Commercial ‘C’ grade. It offers an expanded temperature range ($-40 ° C$ untuk $ + 100 ° C$) while maintaining identical electrical and timing characteristics within the standard commercial window.

Why is this part in a “G” package?

The “G” signifies that the SF363 package is Lead-Free (RoHS compliant). This is essential for modern MRO (Maintenance, Repair, and Operations) to comply with environmental regulations without changing the original hardware design.

How do you ensure the quality of these mature-market parts?

We understand that sourcing Virtex-4 parts in 2026 requires diligence. We provide full visual inspection, marking verification, and can provide X-ray analysis or solderability testing upon request to ensure the integrity of our stock.

Need a technical datasheet or a quote for a specific Date Code?

Maintaining legacy hardware shouldn’t be a gamble. We provide traceable, high-reliability silicon for mission-critical systems.

Would you like me to pull the specific power-on sequence requirements or the IBIS models for this SF363 package?

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