XC4VLX100-10FFG1148I

제조업체: 자일링스
로직 셀: 110,592
로직 슬라이스: 49,152 (approx)
임베디드 RAM(eRAM): 4,320 Kb (240 × 18Kb Block RAM)
패키지: FFG1148 (Flip-Chip BGA)
작동 온도: 산업용(-40°C ~ +100°C)

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    사양

    모델 P/N시리즈실험실/CLBS 수속도 등급논리 요소/셀 수총 램 비트I/O 수전압 - 공급마운팅 유형작동 온도패키지 / 케이스공급업체 디바이스 패키지
    XC4VLX100-10FFG1148IVirtex-4 LX11.520,00-10,009984044789767681.14V ~ 1.26V표면 실장-40 °C ~ +100 °C (Industrial)1148-BBGA (FCBGA)1148-FCBGA

    XC4VLX100-10FFG1148I: High-Density Industrial FPGA for Robust System Logic

    그리고 XC4VLX100-10FFG1148I is a high-performance, industrial-grade FPGA member of the Xilinx Virtex®-4 LX family. Built on the innovative 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device is specifically engineered for designers who require a massive logic fabric—110,592 Logic Cells—without moving to the extreme power envelopes of the LX160 or LX200 variants.

    Housed in the FFG1148 Lead-Free Flip-Chip BGA package, this device is binned for Industrial-grade (-40°C to +100°C) operation, ensuring timing stability and long-term reliability in the most demanding environmental conditions.

    Core Engineering Highlights

    • Logic Capacity & Scalability: With 110,592 Logic Cells and over 12,000 CLBs, the LX100 provides the “headroom” necessary to consolidate multiple IP cores, custom state machines, and high-speed protocol bridges into a single chip.

    • Industrial Thermal Resilience: 그리고 “-I” rating ensures that the FPGA maintains its -10 speed grade timing characteristics across a wide temperature spectrum. This is a critical requirement for outdoor telecommunications infrastructure and ruggedized industrial automation.

    • Massive I/O Density: 그리고 FFG1148 package exposes 768 User I/Os. Leveraging Xilinx’s SelectIO™ technology, it supports an extensive array of differential (LVDS) and single-ended (HSTL/SSTL) signaling standards, ideal for interfacing with high-width DDR2 or QDR memory banks.

    • Dedicated DSP Power: Integrated with 96 DSP48 slices. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, enabling real-time signal processing and filtering without exhausting general logic fabric.

    • Optimized Memory Hierarchy: 특징 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput data streams.


    Technical Specification Matrix

    기능사양
    논리 셀110,592
    Total Block RAM4,320 Kb
    DSP48 Slices96
    User I/Os768
    속도 등급-10
    작동 온도Industrial (-40°C to +100°C Tj)
    패키지FFG1148 (Lead-Free / 1.0mm Pitch)
    코어 전압1.2V

    Why Specify the LX100-10I?

    1. Predictable Timing Closure

    The ASMBL architecture interleaves logic, memory, and DSP columns, which significantly reduces routing congestion. For engineers working on designs with >80% logic utilization, the LX100-10I offers much more predictable timing closure compared to less advanced architectures.

    2. Superior Signal Integrity

    그리고 FFG1148 Flip-Chip package is specifically designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Simultaneous Switching Noise (SSN), which is vital for maintaining robust noise margins in high-speed parallel bus designs.

    3. Long-Lifecycle Stability

    The Virtex-4 series remains a cornerstone for high-reliability systems with 10–15 year service requirements. Choosing the LX100-10I provides a proven, well-documented platform with a stable toolchain, reducing the risk of mid-lifecycle architectural bugs.


    Primary Applications

    • Industrial Control: Multi-axis robotics and high-precision motor control.

    • Telecommunications: Base station signal processing and localized switching.

    • Medical Equipment: Real-time data acquisition for CT/MRI reconstruction backends.

    • Defense & Aerospace: Ground support systems and secure communication bridges.