Infineon Adjusts 8-inch Wafer Allocation, Automotive Grade MOSFET & IGBT Lead Time Extended to 32–46 Weeks with Price Hike of 9%–18%

In early August 2026, Infineon rolled out new wafer allocation strategies for its 8-inch production lines. More wafer resources are prioritized for high-end traction IGBT modules used in new energy passenger vehicles and commercial trucks, while production quotas for discrete automotive MOSFETs and standard industrial IGBTs are reduced significantly.
The manufacturer has notified authorized distributors of a new round of price adjustment, effective September 2026. Most automotive discrete power devices will see price increases ranging from 9% to 18 weeks. New order lead times for standard automotive MOSFET and IGBT components stretch to 32–46 weeks.
Many loose spot lots circulating in the market lack complete traceability and cannot pass strict automotive reliability testing. LXBCHIP maintains large stock of original sealed Infineon power semiconductors with full batch code traceability. We provide sample urgent shipment, full BOM support and stable bulk supply to help manufacturers bypass long factory waiting cycles.
Conclusion

Tight supply of automotive power discrete devices will continue into Q1 2027. Procurement teams should lock spot inventory in advance to avoid production suspension. Contact our sales team to check real-time stock and apply volume discounts.

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Wolfspeed & Rohm Cut SiC Wafer Allocation For Mid-range Automotive Chips, Global Vehicle-grade SiC MOSFET Lead Time Extended to 36–52 Weeks Along With New Round Price Increase

Wolfspeed and Rohm, two leading global SiC chip manufacturers, have adjusted internal wafer allocation schemes in Q3 2026. They concentrate most 6-inch and 8-inch SiC substrate production capacity on high-voltage premium automotive SiC chips, drastically reducing the monthly output quota of mainstream mid-range SiC MOSFET and SiC diode chips used for on-board power conversion.
Accompanied by capacity compression, both manufacturers launched the second price increase within half a year, with quotation rising 12%~24% for all automotive SiC discrete chips and power modules. Authorized global distributors can only receive limited fixed monthly allocations, and new order lead times for conventional automotive SiC chips have been prolonged to 36–52 weeks.
Circulating spot stocks in the market are mixed with refurbished disassembled chips and recoded counterfeit devices, which cannot meet AEC-Q100 vehicle-grade reliability standards.

LXBCHIP pre-stocked large quantities of genuine original sealed SiC chips from Infineon, Wolfspeed, Rohm and onsemi. All chips have traceable batch codes and complete official certification. We support sample urgent delivery, batch separate shipment and full BOM matching service for power semiconductors, helping customers evade long factory waiting cycles and successive price hikes.

Conclusion

Shortage of automotive SiC chips will persist until the first half of 2027. Purchasers should lock spot inventory in advance to ensure continuous material supply. Contact our sales team to check real-time stock and apply for bulk preferential prices.