| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX130T-2FF1738I | Virtex-5 FXT | 10.240,00 | -2,00 | 131072 | 10985472 | 840 | 0,95 V-1,05 V | Pemasangan di Permukaan | -40 °C ~ +100 °C | 1738-FBGA, FCBGA | 1738-FCPBGA (42.5×42.5 mm) |
Xilinx XC5VFX130T-2FF1738I | Virtex-5 FXT Industrial Grade High-Performance FPGA
The XC5VFX130T-2FF1738I is a flagship FPGA engineered for ultra-demanding industrial and mission-critical systems. This device represents the high-performance tier of the Virtex-5 FXT family, combining -2 tingkat kecepatan efficiency with a rugged Industrial temperature rating (-40°C to +100°C). With dual PowerPC® 440 cores and 20 high-speed GTX transceivers, it provides a robust platform for complex data-path acceleration in harsh environments.
Di LXB Semicon, we specialize in high-value, high-reliability Xilinx silicon, providing fully verified and traceable XC5VFX130T-2FF1738I units to our global partners.
Core Technical Specifications
The XC5VFX130T is one of the largest devices in the FXT sub-family, optimized for maximum I/O and processing density:
| Fitur | Detailed Specification |
| Sel Logika | 131,072 |
| Tingkat Kecepatan | -2 (Enhanced Performance) |
| Suhu Pengoperasian | -40°C to +100°C (Industrial Grade) |
| Embedded Processors | 2 x PowerPC® 440 Blocks |
| RocketIO™ GTX | 20 Transceivers (supporting up to 6.5 Gbps) |
| Irisan DSP48E | 320 |
| Max User I/O | 840 |
| Paket | FF1738 (1738-pin Flip-Chip BGA) |
Why the “2I” Configuration is Critical for Your Design
For systems operating at the edge of performance and environmental limits, the XC5VFX130T-2FF1738I offers distinct advantages:
1. Industrial-Grade Thermal Resilience
The -I rating ensures that the FPGA maintains timing closure and logic stability under extreme cold and heat (-40°C to +100°C). This is a non-negotiable requirement for outdoor telecom infrastructure, avionics, and heavy industrial automation.
2. Superior Timing with -2 Speed Grade
The -2 tingkat kecepatan provides faster clock speeds and lower propagation delays than the standard -1 grade. In a design utilizing over 130k logic cells, this extra margin is often the difference between a system that meets its timing constraints and one that requires costly redesign.
3. Massive Processor & I/O Density
The integration of dual PowerPC cores allows for sophisticated hardware/software partitioning. Combined with 840 user I/Os, this chip can act as a centralized controller for massive sensor arrays or complex backplane communication systems.
4. Legacy Reliability in FF1738 Package
The large 1738-pin package is designed for maximum signal grounding and thermal dissipation, ensuring high signal integrity (SI) for the 20 GTX transceivers operating at multi-gigabit speeds.
High-Value Applications
Defense & Aerospace: Radar signal processing and ruggedized mission computers.
Energy & Infrastructure: Smart grid protection systems and power station monitoring.
Telecommunications: High-capacity base stations and core optical networking.
Specialized Computing: Hardware-in-the-loop (HIL) simulators and financial modeling accelerators.
The LXB Semicon Assurance: Quality & Traceability
When procuring a high-value component like the XC5VFX130T-2FF1738I, the pedigree of the supplier is paramount. LXB Semicon ensures your investment is protected:
Authenticity Guaranteed: Every component is 100% original Xilinx (now AMD) silicon. We provide thorough incoming inspections to ensure factory-new condition.
Industrial Traceability: We provide Date Code (D/C) and Lot Code information, supporting the strict documentation requirements of industrial and military-grade procurement.
Expert Handling: Large BGA packages like the 1738 are sensitive to moisture and ESD. We use vacuum-sealed, moisture-barrier packaging and strict ESD protocols to ensure the integrity of the BGA balls and the silicon.
Longevity Support: We maintain stock for legacy Virtex-5 parts to help our clients avoid the risks of EOL (End-of-Life) components and production delays.
Frequently Asked Questions (FAQ)
Q: Can I use the XC5VFX130T-2FF1738I to replace a commercial grade -1 part?
A: Yes. The -2I version is an “up-grade” that covers the commercial temperature range and exceeds the performance of a -1 speed grade. It is a robust drop-in replacement.
Q: What software is required to program this device?
A: This FPGA is supported by Xilinx ISE® Design Suite (14.7). It is not compatible with the Vivado® platform.
Q: Does the “FF1738” package contain lead?
A: Yes, the FF1738 package is a standard leaded BGA. If your project requires a lead-free solution, you should look for the FFG1738 (with the ‘G’ suffix).
Secure Your Supply of XC5VFX130T-2FF1738I
Looking for a bulk quote or have technical questions? Contact LXB Semicon today for current availability and competitive pricing.
