XC7Z020-2CLG400I
Fabricante: AMD (Xilinx)
Células lógicas: 85,000
Rebanadas lógicas: 13,300
RAM integrada (eRAM): 4,860 Kb (270 × 18Kb Block RAM)
Paquete: CLG400 (CSBGA-400)
Temperatura de funcionamiento: Industrial (-40°C a +100°C)
Especificaciones
Part Number Detailed Breakdown
This is AMD Xilinx Zynq-7000 series AP SoC, adopting 28nm process technology. It integrates dual-core ARM Cortex-A9 processor subsystem and Artix-7 programmable FPGA logic, widely used in cost-sensitive industrial embedded systems.
- XC7Z020: Mainstream mid-range model of Zynq-7000 family
- -2: Speed Grade 2, enhanced timing performance grade with sufficient timing margin for high-speed logic development
- CLG400: 400-ball CSPBGA compact package
- I: Industrial temperature grade, junction temperature operating range: -40°C ~ +100°C
Complete On-Chip Hardware Architecture
1. Processing System (PS Side: ARM Processor Domain)
- Dual-core ARM Cortex-A9 MPCore processors, maximum operating frequency 766MHz
- Each core equipped with independent 32KB instruction cache + 32KB data cache; 256KB shared L2 cache
- Built-in NEON SIMD floating-point acceleration unit for multimedia computing and signal data processing
- Abundant standard embedded peripherals: Dual Gigabit Ethernet, USB2.0 OTG, SD/MMC controller, CAN bus, UART, SPI, I2C, GPIO
- Supports secure boot function to realize system startup security protection
2. Programmable Logic Fabric (PL Side: FPGA Domain, Artix-7 Architecture)
- Total Logic Cells: 85440
- Configurable Logic Slices: 13300
- DSP48E1 dedicated arithmetic units: 220 pieces, applied to digital filtering, FFT operation, sensor data calculation and image preprocessing acceleration
- Total Block RAM storage capacity: 4.9 Mbit
- Multiple MMCM+PLL clock management modules, supporting clock multiplication, division, phase adjustment and jitter suppression for multi-clock domain design
- No integrated high-speed serial GTP transceivers inside the chip
3. I/O Resources & On-Chip Monitoring Module
- Total available user general I/O pins: 156
- Configurable I/O bank voltage: 1.2V / 1.5V / 1.8V / 2.5V / 3.3V, compatible with LVCMOS, LVDS and other differential signal standards
- Embedded dual-channel 12-bit XADC analog monitoring unit: real-time collection of chip internal junction temperature, power supply voltage and external analog input signals
Power Supply Specifications
- Core logic typical voltage: 1.0V
- Independent power domains are set for processor system and programmable logic respectively
- Typical overall power consumption: 4W ~ 18W, passive heat sink cooling can be adopted for miniature embedded equipment
Packaging & SMT Assembly Requirements
- Package type: 400-pin compact CSPBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering work must be completed within 168 hours after vacuum packaging is opened
- Fully lead-free packaging, compliant with global RoHS environmental directives
- Standard delivery: anti-static tray packaging for automated industrial PCB mass production
Environmental & Reliability Features
It can run stably for a long time under severe temperature changes and strong electromagnetic interference environment.
With bitstream encryption protection, SEU error detection function, it meets high reliability requirements of industrial control, vehicle-mounted equipment and outdoor intelligent terminals.
Escenarios típicos de aplicación
- Industrial automation equipment: embedded PLC, servo drive main control board, industrial field gateway
- Embedded machine vision: miniature industrial camera, image acquisition and simple defect detection terminal
- Portable measurement instruments: multi-channel data recorder, vibration monitoring acquisition equipment
- Intelligent Internet of Things gateways, edge data processing nodes
- Medical portable inspection equipment main control and signal preprocessing modules
- Custom embedded core system boards for secondary development
