XC7A200T-2FBG484E
Fabricante: Xilinx
Células lógicas: 215,360
Rebanadas lógicas: 33,650
RAM integrada (eRAM): 13 140 Kb (365 bloques de RAM de 36 Kb)
E/S máxima por usuario: 285
Paquete: FBG484 (BGA con chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Part Number Introduction
This is an extended industrial temperature FPGA chip from Xilinx Artix-7 series, fabricated with mature 28nm low-power process. It focuses on cost optimization while delivering rich logic, DSP and storage resources, ideal for cost-sensitive industrial equipment, portable test devices and embedded vision systems that need stable operation across wide temperature ranges.
- XC7A200T: High-density flagship device of Artix-7 family
- -2: Speed Grade 2, standard balanced timing class. It offers adequate timing margin for most embedded digital circuit designs, striking a fine balance between operating frequency, timing stability and overall power consumption
- FBG484: 484-ball flip-chip BGA compact package, compact outline supports miniaturized hardware layout
- E: Extended industrial temperature specification, operating junction temperature: -40°C ~ +100°C
On-Chip Hardware Resource List
1. General Logic Resources
- Total Logic Cells: 215360
- Available Slices: 33650
- Total Flip-flops: 269200
- Total LUTs: 134600
2. Arithmetic & Memory Resources
- DSP48E1 arithmetic blocks: 740 units, suitable for FFT computation, digital filtering, image signal processing, servo control algorithms and medium matrix calculation acceleration
- Total Block RAM: 13140 Kb, applied for image frame buffering, FIFO data cache, waveform storage and algorithm parameter tables
- Distributed RAM: 3888 Kb
3. Clock Management Modules
- 8 MMCM clock management tiles
- 8 PLL phase-locked loops
Capable of multi-clock domain generation, phase offset adjustment, delay compensation and high-frequency jitter suppression, fulfilling timing synchronization requirements of medium-large embedded digital systems
4. High-Speed Serial Transceivers
- 8 channels of GTX differential transceivers
Maximum data rate: 6.6Gbps, compatible with PCIe Gen2, Gigabit Ethernet, Aurora, CPRI and other mainstream serial communication protocols
5. I/O Resources & On-Board Monitoring Unit
- Configurable user I/O pins: 285
I/O bank voltage configurable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL and common differential signal standards
Dual-channel 12-bit XADC analog monitor integrated on chip, continuously monitors die junction temperature, internal power supply voltages and external analog input signals in real time
Power Parameters
Nominal core supply voltage: 1.0V
Logic array, Block RAM, DSP modules and serial transceivers adopt independent isolated power domains respectively
Typical total power consumption: 4W ~ 17W. Passive heat dissipation can meet long-term continuous operation demands under conventional industrial conditions
Packaging & SMT Specifications
- Package: 484-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3. All reflow soldering work shall be finished within 168 hours after vacuum package opening
- Lead-free packaging, fully compliant with RoHS environmental standards
- Stored and shipped in anti-static trays to prevent electrostatic damage during mass PCB production
Environmental Performance & Reliability
The chip maintains stable long-term operation under temperature variation, mechanical vibration and moderate electromagnetic interference industrial environments. It supports AES bitstream encryption and SEU single-event upset detection, featuring outstanding cost performance and anti-interference ability.
Escenarios típicos de aplicación
- Multi-axis motion controllers, general industrial automation main control boards
- Industrial Ethernet gateways, multi-protocol field bus conversion modules
- Portable multi-channel data acquisition analyzers, on-site environmental & vibration monitoring terminals
- Compact industrial camera image preprocessing units
- Portable medical equipment logic control and data processing modules
- Wide-temperature cost-effective industrial SOM core boards and embedded algorithm verification platforms
