RTL8723BU-CG

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    Especificaciones

    RTL8723BU‑CG is a single-chip 2.4GHz Wi-Fi + Bluetooth combo integrated circuit developed by Realtek Semiconductor, integrating baseband, RF transceiver, power management unit and MAC layer for compact embedded wireless connectivity solutions.

    Suffix Explanation

    • RTL8723BU: Core chip model supporting USB 2.0 host interface, 802.11 b/g/n Wi-Fi and dual-mode Bluetooth 4.0
    • CG: QFN surface-mount package marking, standard tape-and-reel bulk packaging for automated SMT production

    1. Core Wireless Protocol Specifications

    Wi-Fi Function

    • Compliant with IEEE 802.11b/g/n standard, operates exclusively on 2.4GHz ISM band (2402MHz~2484MHz)
    • 1T1R single antenna design, maximum physical layer throughput up to 150Mbps
    • Supports Station client mode and SoftAP hotspot mode
    • Adaptive frequency hopping and anti-interference algorithm to reduce coexistence interference between Wi-Fi and Bluetooth

    Bluetooth Function

    • Dual-mode Bluetooth 4.0, compatible with BR/EDR classic Bluetooth and BLE Bluetooth Low Energy
    • Backward compatible with Bluetooth V2.1+EDR, V3.0, V3.0+HS
    • Supports A2DP audio transmission, HID keyboard/mouse pairing, SPP serial transparent transmission and BLE beacon broadcasting

    2. Electrical & Interface Parameters

    • Primary host communication interface: USB 2.0 High-Speed, no extra external bus required
    • Operating supply voltage: 3.0V ~ 3.6V, typical recommended 3.3V
    • Maximum transmit current under full power: below 300mA
    • Built-in multiple low-power sleep modes to reduce power consumption for battery-powered terminals
    • On-chip integrated crystal oscillator circuit, only an external 40MHz crystal is needed for clock generation
    • Reserved multi-function GPIO pins for hardware wake-up, status indication and peripheral control

    3. Package & Mechanical Information

    • Package type: QFN leadless quad flat no-leads package with exposed thermal pad
    • Moisture Sensitivity Level: MSL 3, reflow soldering must be completed within 168 hours after opening the moisture-proof vacuum package
    • Exposed bottom pad enhances thermal dissipation during continuous high-power RF emission
    • Standard factory shipment adopts tape-and-reel packaging with fixed quantity per reel

    4. Environmental & Compliance Standards

    • Operating ambient temperature range: -10 ℃ ~ +70 ℃
    • Fully lead-free manufacturing, RoHS and REACH compliant without restricted hazardous substances
    • Passes FCC, CE certification for wireless emission standards

    5. Typical Application Scenarios

    USB Wi-Fi Bluetooth adapters for desktop computers and notebook PCs IP cameras, NVR video monitoring equipment and network storage devices Smart set-top boxes, projectors, smart TVs and multimedia playback hardware Smart home gateways, household appliances and IoT wireless sensing terminals Portable speakers, handheld testing instruments and embedded single-board computers

    LXB Semicon supplies original Realtek RTL8723BU‑CG Wi-Fi Bluetooth combo IC