ADXL357BEZ

This is a hermetically sealed industrial-grade three-axis digital MEMS accelerometer from Analog Devices, belonging to the ADXL35x high-precision sensor family. Compared with ADXL355, it expands larger acceleration measurement ranges, retains ultra-low drift and excellent environmental adaptability, mainly used for high-amplitude vibration monitoring, impact detection and heavy-load inertial measurement scenarios.

ADXL357 stands for wide-range digital triaxial acceleration sensor core model. BEZ represents hermetic metal sealed 14-pin LCC surface mount packaging, delivered in tray packaging without standard tape reel specification, suitable for prototype verification and batch industrial equipment production assembly

Three optional full-scale measurement ranges: ±10g、±20g、±40g, matched with built-in 20-bit high-resolution sigma-delta ADC digital output. Sensitivity varies with ranges, the maximum resolution reaches 51200 LSB/g under ±10g mode, which can capture tiny acceleration changes while coping with strong vibration and shock signals.

Ultra-low noise density is 75μg/√Hz across all three axes; maximum zero-g offset temperature drift is limited to 0.75mg/℃, long-term measurement stability is outstanding, greatly reducing regular manual calibration frequency for unattended field devices.

Dual digital communication interfaces SPI and I2C are integrated internally, with programmable digital high/low pass filters to filter out environmental electromagnetic noise. A 96-level FIFO data buffer is built-in to ease MCU data reading pressure; on-chip temperature sensor and electromechanical self-test function support regular equipment performance inspection and fault diagnosis.

Power supply voltage range 2.25V~3.6V, perfectly matching mainstream embedded 3.3V power domain. Operating current is 200μA under normal measurement mode, standby current only 21μA, well adapted to battery-powered wireless monitoring terminals. Adjustable signal bandwidth ranges from 1Hz up to 1kHz, flexible for slow tilt measurement and high-frequency vibration acquisition

Adopts 14-pin fully sealed LCC ceramic metal packaging, overall dimension 6mm×5.6mm×2.2mm. The airtight cavity structure isolates moisture, dust and corrosive gas erosion, effectively preventing sensor performance attenuation under long-term harsh working conditions

Classified as MSL3 moisture sensitive component, all reflow soldering operations must be completed within 168 hours after opening the original vacuum package. Standard tray packaging is adopted to cooperate with automatic SMT mounting equipment for mass production welding inspection

Wide continuous operating temperature range covers -40℃ ~ +125℃, capable of stable operation in industrial cabinets, engineering machinery, outdoor bridge facilities and vehicle-mounted electronic systems with drastic temperature fluctuation. The whole chip adopts lead-free production process and complies with global environmental material restriction norms. Hermetic packaging brings ultra-long service life for field unattended monitoring equipment.

Industrial mechanical equipment bearing vibration fault diagnosis, heavy machine spindle impact monitoring

Bridge, tower, large steel structure high-amplitude vibration and structural safety detection

Seismic monitoring equipment, geological shock wave collection and underground pipeline safety inspection

Engineering machinery, construction vehicle inertial attitude control and collision detection modules

Portable impact testing instruments, high-end inertial measurement units and tilt monitoring terminals

LXB Semicon supplies original Analog Devices ADXL357BEZ sealed wide-range three-axis high-precision digital accelerometer IC