xcku3p-l1ffvvb676i

Part Number Full Definition

1. XCKU3P: Entry mid-range device of Kintex UltraScale+ series with integrated UltraRAM large-capacity on-chip memory
2. L1: Low-power optimized speed grade 1 (LI). Supports dual core voltage operation: 0.85V for standard timing, or 0.72V for maximum power saving with reduced operating frequency; lowest power consumption tier for this chip model
3. FFVB676: 676-ball flip-chip FCBGA compact package, die size 27mm × 27mm, ball pitch 1.0mm
4. I: Industrial temperature grade, junction temperature operating range: -40 درجة مئوية ~ +100 درجة مئوية

On-Chip Core Hardware Resources

Logic & DSP Arithmetic Units

• Total System Logic Cells: 356,000
• Total LUTs: 163,000
• Total Flip-Flops: 325,000
• DSP48E2 dedicated arithmetic slices: 1368 units

  Applied for digital filtering, FFT computation, wireless baseband preprocessing, lightweight image algorithm acceleration and small matrix calculations

موارد الذاكرة المدمجة

• Block RAM total capacity: 12.7 Mb
• UltraRAM dedicated large memory: 13.5 Mb (unique advantage of P-series chips, ideal for frame buffer, deep data buffering)
• Distributed RAM (LUT-based): 4.7 Mb for ultra-low latency temporary cache

Clock Management Subsystem

High-Speed Serial Transceivers & General I/O

• 8-channel GTH high-speed differential transceivers, maximum single lane rate: 16.375 Gbps

  Supported protocols: PCIe Gen3, JESD204B/C, 10G Ethernet, Aurora serial transmission

• Available user configurable I/O pins: 280

  Includes HR wide-voltage I/O banks and HP high-performance I/O banks; compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards

• Built-in SYSMON system monitor: real-time detection of chip junction temperature, internal power rail voltages and external analog input signals

مواصفات مصدر الطاقة

• Standard core voltage: 0.85 V
• Low-power mode core voltage: 0.72 V (greatly cuts static & dynamic power consumption, timing performance downgraded to L1 baseline level)

  Independent power domains assigned for core logic, UltraRAM, Block RAM, transceivers and I/O banks

  Typical total power consumption: 7W ~ 26W; passive heat dissipation is available for compact portable embedded hardware

متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)

• Package: 676-pin flip-chip FCBGA ball grid array
• Moisture Sensitivity Level: MSL4; all reflow soldering must be finished within 72 hours after vacuum packaging unsealed
• Fully lead-free, RoHS3 & REACH compliant
• Delivered in anti-static trays for automated industrial PCB mass production

Environmental & Reliability Features

سيناريوهات التطبيق النموذجية

1. Portable software-defined radio, handheld wireless signal transceiving and baseband processing modules
2. Battery-powered multi-channel data recorders, vibration monitoring and portable precision measuring instruments
3. Miniature airborne short-range radar front-end echo signal acquisition & processing boards
4. Vehicle-mounted peripheral control units, in-vehicle low-power video preprocessing terminals
5. Compact embedded machine vision inspection equipment for field industrial use
6. Low-power PCIe high-speed data acquisition cards and custom industrial SOM core boards