| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xcku095-1ffva1156e | Kintex UltraScale | 67,20 | -1,00 | 1,176,000 جنيه مصري | ~حوالي 60.52 ميغابت | 520 | VCCINT ~ 0.92 فولت | التركيب السطحي (FCBGA) | 0 درجة مئوية إلى +100 درجة مئوية | FCBGA-1156 | 1156-FCBGA |
xcku095-1ffva1156e
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 1,143,360
شرائح المنطق: 178,650
ذاكرة الوصول العشوائي المدمجة (eRAM): 48,960 كيلو بايت (1,360 × 36 كيلو بايت من ذاكرة الوصول العشوائي المجمعة)
الحد الأقصى لإدخال/إخراج المستخدم: 500
الحزمة: FFVA1156 (Flip-Chip BGA)
درجة السرعة: -1
درجة حرارة التشغيل: ممتد (من 0 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تفصيل أرقام القطع
This is AMD Xilinx Kintex UltraScale series high-performance FPGA built on 20nm UltraScale process, optimized for high-throughput data processing, wireless baseband, network acceleration and multi-channel high-speed serial transmission applications.
- XCKU095: Large-capacity flagship model of Kintex UltraScale family
- -1: Speed Grade 1, baseline timing grade, cost-optimized for non-extreme high-frequency design scenarios
- FFVA1156: 1156-ball flip-chip FCBGA surface-mount package
- E: Extended commercial temperature grade, junction temperature operating range: 0 درجة مئوية ~ +100 درجة مئوية
الموارد الأساسية للأجهزة المدمجة في الرقاقة
موارد الحوسبة المنطقية ومعالجة الإشارات الرقمية (DSP)
- Total Logic Cells: 1,176,000
- Total Look-Up Tables (LUTs): 537,600
- Total Flip-Flops: 1,075,200
- DSP48E2 arithmetic slices: 2,760 units
For massive FFT, digital filtering, 5G/4G wireless baseband processing, matrix computation, AI lightweight inference and high-throughput signal arithmetic operations
موارد الذاكرة المدمجة
- Total Block RAM capacity: 59.1 Mbit
Consists of independent 36K dual-port RAM blocks for large data buffering, FIFO queues and algorithm intermediate storage; LUT-based distributed RAM supports ultra-low latency tiny cache
Clock Management Subsystem
Multiple MMCM + PLL clock management tiles integrated on chip, supporting clock multiplication/division, arbitrary phase adjustment, jitter filtering and multi-clock domain generation, adapting to ultra-high-speed synchronous digital system timing requirements
High-Speed Serial Transceivers & General I/O
- 20-channel GTH high-speed differential transceivers, maximum single-lane rate up to 16.375 Gbps
Supported protocols: PCIe Gen3, 10G Ethernet, Aurora, JESD204B/C, Interlaken, fiber optical transmission
- Total available user configurable I/O pins: 520
Includes HP high-performance I/O banks and HR high-range voltage I/O banks; supports LVCMOS, LVDS, differential HSTL/SSTL and all mainstream industrial signal standards; configurable I/O voltage from 1.2V to 3.3V
- Built-in SYSMON system monitoring module: real-time monitoring of chip internal temperature, multi-group power supply voltages and external analog input signals
مواصفات مصدر الطاقة
- Nominal core logic voltage (VCCINT): 0.92V ~ 0.98V
Independent power domains configured for core logic, block RAM, transceivers and I/O banks; dynamic voltage/frequency scaling is supported to reduce power consumption under light load
Typical full-load overall power consumption: 70W ~ 130W, forced air cooling or liquid cooling is required for continuous stable operation
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package: 1156-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be completed within 168 hours after vacuum packaging is opened
- Fully lead-free construction, compliant with global RoHS environmental directives
- معبأة في صواني مقاومة للكهرباء الساكنة من أجل الإنتاج الصناعي الآلي للوحات الدوائر المطبوعة (PCB) بكميات كبيرة
الخصائص البيئية وخصائص الموثوقية
Only extended commercial temperature specification, suitable for indoor industrial equipment, communication room and stable ambient environments, not applicable to outdoor low-temperature extreme working conditions.
Supports 256-bit AES bitstream encryption for IP protection, SEU single-event upset radiation error correction, partial dynamic reconfiguration and integrated PCIe hard macro, with excellent long-term operational stability
سيناريوهات التطبيق النموذجية
- Wireless communication equipment: 4G/5G macro station & small cell baseband processing boards, radio remote unit signal processing modules
- Network & storage acceleration: data center smart NIC, storage array controller, 100G Ethernet switching and gateway hardware
- High-end industrial machine vision: multi-camera synchronous image processing, medical imaging reconstruction and backhaul equipment
- High-precision test instruments: multi-channel oscilloscopes, spectrum analyzers and ultra-high-speed data acquisition cards
- Radar signal processing, aerospace onboard data forwarding and high-speed parallel computing acceleration platforms
- Custom FPGA acceleration boards for algorithm verification and prototype development
