XC4VFX100-11FFG1517C FPGA
Manufacturer:** AMD (Xilinx)
Manufacturer Part Number:** XC4VFX100-11FFG1517C
Device Type:** FPGA (Field-Programmable Gate Array)
Package:** 1517‑ball FCBGA
I/O Count:** 768 user I/O pins
Speed Grade:** ‑11
The XC4VFX100‑11FFG1517C is part of the **Virtex‑4 FX family**, designed for high‑performance embedded processing and data‑intensive applications where logic density, I/O scalability, and system integration are critical.
Positioning Within the Virtex‑4 FX Family
The Virtex‑4 FX series combines traditional FPGA logic resources with integrated processing and high‑speed interfaces, making it suitable for designs that require both **hardware acceleration and flexible system control**.
The XC4VFX100 variant is typically selected when projects demand:
* A high number of user I/O pins
* Complex board‑level connectivity
* Deterministic performance for real‑time systems
* Long product lifecycle support in industrial or infrastructure equipment
Key Engineering Characteristics
From a hardware design perspective, the XC4VFX100‑11FFG1517C offers several practical advantages:
768 I/O pins** allow extensive peripheral and backplane connectivity
FCBGA package** supports high‑density routing and reliable mechanical stability
Speed grade ‑11** enables higher timing margins for demanding designs
Proven architecture widely deployed in legacy and long‑life platforms
These characteristics make the device suitable for complex, multi‑interface boards where pin availability and signal integrity are critical design factors.
Typical Application Scenarios
Although Virtex‑4 devices are considered mature technology, they remain actively used in many long‑term programs due to stability and qualification history.
Common application areas include:
Industrial automation and control systems
Embedded computing platforms
Telecom and networking infrastructure
Video and signal processing equipment
Aerospace, defense, and test instrumentation
In many of these systems, redesigning to a newer FPGA family is not always practical due to **certification cost, software dependency, or lifecycle constraints**.
Package and PCB Design Considerations
The 1517‑ball FCBGA package requires careful attention during PCB design:
Multi‑layer boards are typically required for effective fan‑out
Controlled impedance routing is recommended for high‑speed signals
Power integrity and decoupling strategy are critical due to device complexity
Engineers should evaluate PCB stack‑up and manufacturing capability early in the design or re‑spin phase to avoid yield and reliability issues.
Supply Chain and Lead Time Considerations
The standard manufacturer lead time for XC4VFX100‑11FFG1517C is approximately **1 week**, which can impact project schedules and production planning.
For OEM and EMS teams, key considerations include:
Forecasting demand early for long‑lead components
Evaluating buffer stock for production continuity
Identifying qualified alternatives or migration paths when applicable
Managing supply proactively is especially important for Virtex‑4 series devices used in **long‑lifecycle industrial programs**.
The XC4VFX100‑11FFG1517C FPGA continues to play an important role in industrial and embedded systems that demand high I/O density and predictable performance. While newer FPGA families exist, the Virtex‑4 FX series remains relevant in applications where redesign is costly or impractical.
LXBsemicon is a professional semiconductor supplier based in China. We focus on stable sourcing and long-term support for industrial and embedded applications, helping our customers maintain reliable production and project continuity.
XC4VFX100-11FFG1517C is currently in stock.
For availability, pricing, or technical details, please feel free to contact us.
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