| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-2FFG1156E | Bộ xử lý hệ thống (SoC) Zynq-7000 | 0,00 | -2,00 | 444.000 LE | 27787264 | 400 | 0,97 – 1,03 V (thông thường là 1,0 V) | Lắp đặt bề mặt | 0 °C — 100 °C | FFG-1156 / FCBGA-1156 | 1156-FCBGA (35×35 mm) |
XC7Z100-2FFG1156E
Nhà sản xuất: Xilinx
Tế bào logic: ~101,000
Bộ nhớ RAM tích hợp (eRAM): ~4.9 Mb
Số lượng I/O: ~1.156 lượt ghim
Gói: FFG?1156
Nhiệt độ hoạt động: Thương mại (0°C đến +85°C)
Thông số kỹ thuật
Giải thích về mã sản phẩm
This is the flagship extended industrial temperature heterogeneous all-programmable SoC of AMD Xilinx Zynq-7000 family, built on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and full-spec Kintex-7 maximum-capacity FPGA fabric, designed for high-throughput signal processing, multi-channel high-definition video computing, rugged communication and precision test equipment working under wide temperature industrial environments.
- XC7Z100: Top flagship model across the entire Zynq-7000 lineup, equipped with the largest FPGA resource set of Kintex-7 architecture
- -2: Speed Grade 2, mainstream balanced performance grade, ideal for most complex high-frequency logic design, balancing timing margin, operating frequency and overall power consumption
- FFG1156: 1156-ball flip-chip FCBGA large package, abundant pins reserved for general I/O, high-speed transceivers and extended peripheral signals
- E: Extended industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
Complete On-Chip Hardware Architecture
1. Hệ thống xử lý (PS: Hệ thống con ARM)
- Dual-core ARM Cortex-A9 MPCore processor, maximum stable operating frequency up to 866MHz under wide-temperature industrial configuration, peak frequency 1000MHz
- Each core owns independent 32KB instruction L1 cache + 32KB data L1 cache; 1MB shared L2 cache
- Integrated NEON SIMD floating-point & FPU unit for massive signal algorithm calculation, multimedia encoding/decoding acceleration
- On-chip 256KB OCM on-chip memory; supports DDR2/DDR3/DDR3L external high-speed memory expansion
- Full set of embedded peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO, 8-channel DMA controller
- 256-bit AES secure boot with SHA-256 integrity verification, preventing firmware tampering for industrial system safety
2. Programmable Logic (PL: Kintex-7 Top-tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applied for massive FFT, digital filtering, wireless baseband processing, multi-channel 4K image algorithm acceleration and large-scale matrix computation
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM and PLL clock management tiles for multi-domain clock generation and high-frequency jitter suppression
- 16 GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 528
- I/O bank voltage adjustable from 1.2V to 3.3V, fully supports LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
Thông số kỹ thuật bộ nguồn
Nominal core operating voltage: 1.0V
Independent isolated power domains are allocated separately for PS processor area and PL FPGA logic area
Typical overall power consumption: 16W ~ 39W; active forced-air cooling heatsink is required for long-term full-load stable operation under high-temperature working conditions
Yêu cầu về đóng gói và lắp ráp SMT
- Package: 1156-pin flip-chip FCBGA ball grid array
- Mức độ nhạy cảm với độ ẩm: MSL4; tất cả các quy trình hàn nóng chảy phải được hoàn thành trong vòng 72 giờ sau khi mở bao bì chân không
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Khả năng thích ứng với môi trường và độ tin cậy
Capable of continuous stable operation under wide temperature variation, vibration and moderate electromagnetic interference harsh industrial environments.
It supports AES bitstream encryption and SEU single-event upset error detection, with enhanced thermal and electrical robustness for outdoor communication equipment, rugged field test instruments, vehicular high-performance computing terminals and lightweight airborne embedded systems.
Các tình huống ứng dụng điển hình
- Software-defined radio baseband platforms, rugged wireless communication test measurement instruments
- Outdoor multi-channel video surveillance encoding, intelligent analysis and edge computing gateways
- Portable high-end oscilloscopes, spectrum analyzers and multi-channel high-speed data acquisition recorders
- Vehicular ADAS multi-sensor fusion computing main control units
- Miniature airborne radar signal preprocessing and data forwarding modules
- Extended-temperature industrial high-performance SOM core modules and complex embedded algorithm verification platforms
