| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-2FFG1156E | Zynq-7000 SoC | 0,00 | -2,00 | 444.000 LE | 27787264 | 400 | 0,97 - 1,03 V (tipikal 1,0 V) | Pemasangan di permukaan | 0 ° C - 100 ° C | FFG-1156 / FCBGA-1156 | 1156-FCBGA (35×35 mm) |
XC7Z100-2FFG1156E
Produsen: Xilinx
Sel Logika: ~101,000
RAM tertanam (eRAM): ~4.9 Mb
Hitungan I/O: ~1,156 pins
Paket: FFG?1156
Suhu Pengoperasian: Komersial (0°C hingga +85°C)
Spesifikasi
Penjelasan Nomor Bagian
This is the flagship extended industrial temperature heterogeneous all-programmable SoC of AMD Xilinx Zynq-7000 family, built on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and full-spec Kintex-7 maximum-capacity FPGA fabric, designed for high-throughput signal processing, multi-channel high-definition video computing, rugged communication and precision test equipment working under wide temperature industrial environments.
- XC7Z100: Top flagship model across the entire Zynq-7000 lineup, equipped with the largest FPGA resource set of Kintex-7 architecture
- -2: Speed Grade 2, mainstream balanced performance grade, ideal for most complex high-frequency logic design, balancing timing margin, operating frequency and overall power consumption
- FFG1156: 1156-ball flip-chip FCBGA large package, abundant pins reserved for general I/O, high-speed transceivers and extended peripheral signals
- E: Extended industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor, maximum stable operating frequency up to 866MHz under wide-temperature industrial configuration, peak frequency 1000MHz
- Each core owns independent 32KB instruction L1 cache + 32KB data L1 cache; 1MB shared L2 cache
- Integrated NEON SIMD floating-point & FPU unit for massive signal algorithm calculation, multimedia encoding/decoding acceleration
- On-chip 256KB OCM on-chip memory; supports DDR2/DDR3/DDR3L external high-speed memory expansion
- Full set of embedded peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO, 8-channel DMA controller
- 256-bit AES secure boot with SHA-256 integrity verification, preventing firmware tampering for industrial system safety
2. Programmable Logic (PL: Kintex-7 Top-tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applied for massive FFT, digital filtering, wireless baseband processing, multi-channel 4K image algorithm acceleration and large-scale matrix computation
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM and PLL clock management tiles for multi-domain clock generation and high-frequency jitter suppression
- 16 GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 528
- I/O bank voltage adjustable from 1.2V to 3.3V, fully supports LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
Spesifikasi Catu Daya
Nominal core operating voltage: 1.0V
Independent isolated power domains are allocated separately for PS processor area and PL FPGA logic area
Typical overall power consumption: 16W ~ 39W; active forced-air cooling heatsink is required for long-term full-load stable operation under high-temperature working conditions
Persyaratan Pengemasan & Perakitan SMT
- Package: 1156-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be finished within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental Adaptability & Reliability
Capable of continuous stable operation under wide temperature variation, vibration and moderate electromagnetic interference harsh industrial environments.
It supports AES bitstream encryption and SEU single-event upset error detection, with enhanced thermal and electrical robustness for outdoor communication equipment, rugged field test instruments, vehicular high-performance computing terminals and lightweight airborne embedded systems.
Skenario Aplikasi Umum
- Software-defined radio baseband platforms, rugged wireless communication test measurement instruments
- Outdoor multi-channel video surveillance encoding, intelligent analysis and edge computing gateways
- Portable high-end oscilloscopes, spectrum analyzers and multi-channel high-speed data acquisition recorders
- Vehicular ADAS multi-sensor fusion computing main control units
- Miniature airborne radar signal preprocessing and data forwarding modules
- Extended-temperature industrial high-performance SOM core modules and complex embedded algorithm verification platforms
