| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc7z100-2ffg1156e | Zynq-7000 SoC | 0,00 | -2,00 | 444,000 جنيه مصري | 27787264 | 400 | 0.97 - 1.03 فولت (نموذجي 1.0 فولت) | التركيب على السطح | 0 درجة مئوية - 100 درجة مئوية | FFG-1156 / FCBGA-1156 | 1156-FCBGA (35 × 35 مم) |
xc7z100-2ffg1156e
الشركة المصنعة: زيلينكس
الخلايا المنطقية: ~101,000
ذاكرة الوصول العشوائي المدمجة (eRAM): حوالي 4.9 ميغابايت
عدد الإدخال/الإخراج: ~1,156 pins
الحزمة: FFG?1156
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)
المواصفات
شرح رقم القطعة
This is the flagship extended industrial temperature heterogeneous all-programmable SoC of AMD Xilinx Zynq-7000 family, built on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and full-spec Kintex-7 maximum-capacity FPGA fabric, designed for high-throughput signal processing, multi-channel high-definition video computing, rugged communication and precision test equipment working under wide temperature industrial environments.
- XC7Z100: Top flagship model across the entire Zynq-7000 lineup, equipped with the largest FPGA resource set of Kintex-7 architecture
- -2: Speed Grade 2, mainstream balanced performance grade, ideal for most complex high-frequency logic design, balancing timing margin, operating frequency and overall power consumption
- FFG1156: 1156-ball flip-chip FCBGA large package, abundant pins reserved for general I/O, high-speed transceivers and extended peripheral signals
- E: Extended industrial temperature grade, operating junction temperature range: -40 درجة مئوية ~ +100 درجة مئوية
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor, maximum stable operating frequency up to 866MHz under wide-temperature industrial configuration, peak frequency 1000MHz
- Each core owns independent 32KB instruction L1 cache + 32KB data L1 cache; 1MB shared L2 cache
- Integrated NEON SIMD floating-point & FPU unit for massive signal algorithm calculation, multimedia encoding/decoding acceleration
- On-chip 256KB OCM on-chip memory; supports DDR2/DDR3/DDR3L external high-speed memory expansion
- Full set of embedded peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO, 8-channel DMA controller
- 256-bit AES secure boot with SHA-256 integrity verification, preventing firmware tampering for industrial system safety
2. Programmable Logic (PL: Kintex-7 Top-tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applied for massive FFT, digital filtering, wireless baseband processing, multi-channel 4K image algorithm acceleration and large-scale matrix computation
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM and PLL clock management tiles for multi-domain clock generation and high-frequency jitter suppression
- 16 GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 528
- I/O bank voltage adjustable from 1.2V to 3.3V, fully supports LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
مواصفات مصدر الطاقة
Nominal core operating voltage: 1.0V
Independent isolated power domains are allocated separately for PS processor area and PL FPGA logic area
Typical overall power consumption: 16W ~ 39W; active forced-air cooling heatsink is required for long-term full-load stable operation under high-temperature working conditions
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package: 1156-pin flip-chip FCBGA ball grid array
- مستوى الحساسية للرطوبة: MSL4؛ يجب إنهاء جميع عمليات اللحام بإعادة التدفق في غضون 72 ساعة بعد فتح العبوة المفرغة من الهواء
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
Capable of continuous stable operation under wide temperature variation, vibration and moderate electromagnetic interference harsh industrial environments.
It supports AES bitstream encryption and SEU single-event upset error detection, with enhanced thermal and electrical robustness for outdoor communication equipment, rugged field test instruments, vehicular high-performance computing terminals and lightweight airborne embedded systems.
سيناريوهات التطبيق النموذجية
- Software-defined radio baseband platforms, rugged wireless communication test measurement instruments
- Outdoor multi-channel video surveillance encoding, intelligent analysis and edge computing gateways
- Portable high-end oscilloscopes, spectrum analyzers and multi-channel high-speed data acquisition recorders
- Vehicular ADAS multi-sensor fusion computing main control units
- Miniature airborne radar signal preprocessing and data forwarding modules
- Extended-temperature industrial high-performance SOM core modules and complex embedded algorithm verification platforms
