ADSP-TS201SABP-050

ADSP-TS201S is a TigerSHARC architecture high-performance floating-point digital signal processor designed for heavy real-time signal processing and multi-processor array construction.

Code explanation:

AB represents industrial temperature range specification, BP stands for 576-ball thermal enhanced BGA package sized 25mm×25mm, the suffix -050 means the rated core working frequency is 500MHz. This part is tin-lead packaged without lead-free treatment, delivered in anti-static trays for automated SMT assembly, and the product series has been discontinued officially.

It adopts static superscalar VLIW dual arithmetic unit architecture, two independent computation modules run in parallel with SIMD execution mode. Each unit integrates arithmetic logic unit, dedicated multiplier and shifter, matched with dual address generators to optimize circular addressing and bit-reversal addressing needed for FFT algorithms.

Supported data types include 8/16/32/64-bit fixed-point values, 32-bit single-precision floating-point numbers and 40-bit extended precision floating-point numbers.

Under 500MHz clock speed, the instruction cycle is 2 nanoseconds, peak floating-point computing capacity reaches 3 GFLOPS, and it can finish complex FFT operations rapidly for radar and acoustic signal processing scenarios.

Total on-chip embedded memory is 24 Mbit, split into multiple independent memory banks which can be arbitrarily assigned to program space and data buffer space. Wide internal buses provide ultra-high access bandwidth to avoid data congestion during continuous algorithm running. There is no built-in flash memory, application programs need to be loaded from external memory after power on.

Four high-speed link ports support direct interconnection between multiple DSP chips without extra logic chips, convenient for building large parallel processing arrays.

14 independent DMA channels undertake background data transmission between internal memory, external SDRAM and inter-chip ports without consuming core computing resources.

Embedded SDRAM controller supports expansion of external large-capacity storage, dual programmable timers, general purpose flag pins and host interface for communication with main control MCU. Standard IEEE 1149.1 JTAG port is reserved for program downloading and online debugging.

Core operating voltage: 1.2 V

I/O interface power supply voltage: 2.5 V

576-ball enhanced thermal BGA package with 25mm × 25mm outline. The bottom large thermal pad improves heat dissipation during long-time full-load operation and enhances grounding stability for high-speed digital circuits.

Moisture Sensitivity Level is MSL3, all reflow soldering work must be completed within 168 hours once vacuum packaging is opened. Anti-static tray packaging is used for industrial batch production.

Continuous stable working temperature range: -40°C ~ +85°C, applicable to airborne devices, ground radar systems, medical imaging equipment and underwater acoustic devices under complex temperature and electromagnetic interference conditions.

This version is traditional tin-lead packaging and does not comply with RoHS lead-free regulations; the corresponding lead-free alternative model is ADSP-TS201SABPZ-050.

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