| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU7P-1FLVC2104E | Virtex® UltraScale+ | 98,52 | -1,00 | 1,724,100 LE | ~506 00000bits | 884 | 0,850 V tipik | SMD / FBGA | 0°C ~ +100°C | FBGA-2104 | 2104-FCBGA |
XCVU7P-1FLVC2104E
Üretici firma: Xilinx
Mantık Hücreleri: 6,860,000
Mantık Dilimleri: 1,070,000
Gömülü RAM (eRAM): 75.900 Kb (2.108 × 36Kb Blok RAM)
Maksimum Kullanıcı I/O: 700
Paket: FLVC2104 (Flip-Chip BGA)
Hız derecesi: -1
Çalışma Sıcaklığı: Genişletilmiş (0°C ila +100°C)
Teknik Özellikler
Parça Numarası Tanımı
This extended commercial temperature low-power FPGA belongs to the Xilinx Virtex UltraScale+ family, manufactured on the 16nm FinFET process. It adopts power-optimized UltraScale+ architecture with balanced logic, computing, storage and high-speed transceiver resources. It is designed for indoor laboratory test instruments, small-scale chip verification platforms, indoor industrial control equipment and data center low-density communication boards running under stable indoor temperature conditions.
- XCVU7P: Mid-entry power-optimized model of Virtex UltraScale+ series. The suffix P represents power-focused optimization, featuring lower static power consumption and optimized internal wiring delay compared with standard versions
- -1: Speed Grade 1, low-power prioritized timing grade. Power efficiency and thermal stability are prioritized over maximum operating frequency, suitable for devices running continuously with limited heat dissipation space
- FLVC2104: 2104-ball flip-chip FCBGA package. Sufficient ball pins support full arrangement of all on-chip GTY transceivers, general-purpose I/O wiring and multi-channel memory interface connection while keeping the device compact in size
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 1724100
- Configurable CLB Slices: 98520
- Total Flip-Flops: 1970400
- Total LUT Lookup Tables: 985200
- Distributed RAM Capacity: 11.2 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E3 arithmetic blocks: 1024 units, capable of fixed-point and floating-point calculations, large-scale FFT spectrum analysis, communication baseband signal processing, cryptographic algorithm acceleration and medium-sized matrix computation tasks
- Total Block RAM Capacity: 38.6 Mb, applied for image frame buffering, deep FIFO data cache, waveform data storage and algorithm parameter tables
No UltraRAM is embedded within this chip
3. Clock Management Subsystem
- 14 MMCM clock management tiles
- 14 PLL phase-locked loops
Multiple independent clock domains can be configured freely. The system supports precise clock phase adjustment, signal delay compensation and high-frequency jitter suppression, meeting strict timing synchronization requirements of complex digital systems
4. High-Speed Serial Transceivers
- 24 GTY differential high-speed transceivers
Each lane supports a maximum transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial protocols. Integrated hard protocol controllers simplify the development of high-bandwidth network interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 416
Various I/O bank voltage options from 1.2V to 3.3V are available, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all common single-ended and differential signal standards
The built-in monitoring module continuously tracks chip junction temperature, internal power supply voltages and external analog input signals in real time
Power Supply Characteristics
The core operating voltage of Speed Grade 1 is set for low-power scenarios, ranging from 0.825V to 0.876V. Logic fabric, block RAM, DSP arrays and serial transceivers are divided into independent power domains, allowing partial module power shutdown to reduce overall power consumption dynamically
Typical overall power consumption ranges from 11W to 39W. For stable continuous full-load operation at the upper temperature limit, forced air cooling is required
Packaging and SMT Assembly Specifications
- Package form: 2104-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental regulations
- Devices are stored and transported in anti-static trays to prevent electrostatic damage during mass PCB assembly
Environmental Adaptability and Reliability
This chip is tailored for indoor constant-temperature environments. It operates reliably under mild temperature fluctuations, slight vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU error detection and correction, without radiation-hardened reinforcement. It cannot adapt to outdoor low-temperature environments and severe rugged working conditions
Tipik Uygulama Senaryoları
- Small and medium-scale ASIC prototype verification platforms and algorithm debugging equipment placed in laboratories
- Low-port 100G optical communication line cards and server internal high-speed interconnection boards
- Desktop spectrum analyzers, arbitrary waveform generators and multi-channel high-speed data acquisition instruments
- Indoor small industrial machine vision inspection and real-time image processing equipment
- Teaching development boards for university electronic and communication majors
- Lightweight industrial data gateways and desktop cryptographic acceleration hardware
