XC7A100T-2FGG484I
Üretici firma: AMD (Xilinx)
Mantık Hücreleri: 101,440
Mantık Dilimleri: 15,850
Gömülü RAM (eRAM): 4,860 Kb (270 × 18Kb Block RAM)
Paket: FGG484 (FBGA-484)
Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)
Teknik Özellikler
Part Number Full Interpretation
This is AMD Xilinx Artix‑7 series cost-effective general-purpose FPGA built on 28nm low-power HKMG semiconductor process, optimized for embedded signal processing, high-speed serial communication and industrial control applications.
- XC7A100T: Core model of Artix‑7 family, mainstream medium-capacity FPGA
- -2: Speed Grade 2, high-performance timing tier with abundant timing margin for complex high-speed logic design
- FGG484: 484-ball FBGA plastic ball grid array package, outline dimension 23mm × 23mm
- I: Industrial temperature grade, junction temperature operating range: -40℃ ~ +100℃
On-Chip Core Hardware Resources
Logic & DSP Arithmetic Units
- Total Logic Cells: 101,440
- Configurable Logic Slices: 15,850
- DSP48E1 dedicated arithmetic slices: 240 units, dedicated to FFT calculation, digital filtering, multiply-accumulate operations, image preprocessing and wireless baseband signal processing
Embedded Memory Resources
- Total Block RAM capacity: 4860 Kbit (composed of independent 18Kb dual-port RAM blocks, for data buffering, FIFO and algorithm intermediate storage)
- Distributed RAM implemented via internal LUT resources for low-latency small-capacity temporary cache
Clock Management Modules
6 Clock Management Tiles (CMT) are integrated on chip; each tile contains 1 MMCM + 1 PLL module. Functions include clock multiplication, division, arbitrary phase adjustment and jitter attenuation, meeting multi-clock domain timing requirements of complex digital systems.
High-Speed Transceivers, I/O & Analog Monitoring Module
- 4-channel GTP high-speed serial transceivers, maximum single-lane transmission rate up to 6.6 Gbps
Compatible protocols: PCIe Gen2, Gigabit Ethernet, Aurora, SFP fiber communication, inter-board high-speed data transmission
- Total available user general I/O pins: 285
- Supports LVCMOS, LVDS, differential signaling and multiple mainstream industrial electrical standards (1.2V/1.5V/1.8V/2.5V/3.3V configurable per I/O bank)
- Built-in dual-channel 12-bit XADC analog monitor: real-time detection of chip internal junction temperature, core power supply voltage and external analog input signals
Power Supply Specifications
- Core logic nominal voltage: 1.0V (operating range: 0.95V ~ 1.05V)
- Multiple independent power domains support dynamic voltage adjustment to balance performance and power consumption
- Typical overall power consumption: 7W ~ 25W, adaptable to passive heat sink cooling schemes for compact embedded devices
Packaging & SMT Assembly Requirements
- Package type: 484-pin plastic FBGA surface mount package, size 23mm × 23mm
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be completed within 168 hours after vacuum packaging is unsealed
- Fully lead-free construction, compliant with global RoHS environmental directives
- Standard packing: anti-static tray for automated industrial PCB mass production
Environmental & Reliability Features
Stable long-term continuous operation under drastic temperature fluctuations and intense electromagnetic interference environments.
Supports 256-bit AES bitstream encryption for hardware IP protection, SEU radiation error correction and partial dynamic reconfiguration functions, satisfying high reliability demands of industrial, vehicle-mounted and outdoor embedded equipment.
Tipik Uygulama Senaryoları
- Industrial automation: multi-axis servo motor control, fieldbus gateway, PLC signal acquisition main control boards
- Embedded machine vision: industrial camera image acquisition, defect detection, real-time video preprocessing
- Compact software-defined radio (SDR), portable wireless signal testing terminals
- Medical portable diagnostic equipment front-end signal acquisition and data processing modules
- High-speed data recorders, portable spectrum analyzers and small precision test instruments
- Edge computing nodes, PCIe high-speed data acquisition cards and custom embedded SOM core boards
