| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX200-10FFG1513C | Virtex-4 LX | 22.272,00 | -10,00 | 200448 | 6193152 | 960 | 1,14 V ~ 1,26 V | Yüzey Montajı | 0 °C ~ +85 °C (Ticari) | 1513-BBGA (FCBGA) | 1513-FCBGA |
XC4VLX200-10FFG1513C: The Ultimate Logic Density for Large-Scale System Integration
Bu XC4VLX200-10FFG1513C is the flagship high-capacity FPGA within Xilinx’s Virtex®-4 LX family. It is engineered for hardware architects who require massive programmable logic resources without moving to multi-chip partitions. Built on the 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, the LX200 provides a staggering 200.448 Mantık Hücresi, making it the definitive choice for high-end commercial applications such as ASIC prototyping, medical imaging, and complex network switching fabrics.
Bu Commercial-grade (0°C to +85°C) device, featuring the -10 hız derecesi, offers the industry’s most balanced logic-to-cost ratio for high-gate-count designs.
Mühendislik Çekirdeğinde Öne Çıkanlar
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Maximum Logic Capacity: With over 200k logic cells, the LX200 allows for the consolidation of entire system-on-chip (SoC) designs, including multiple MicroBlaze™ processors and extensive custom RTL, into a single device.
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Industry-Leading I/O Count: Evin içinde FFG1513 package, this FPGA breaks out 960 User I/Os. This massive I/O density is critical for interfacing with wide parallel buses, dual-bank DDR2 memory, and high-width backplanes.
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Deep Memory Resources: Özellikler 6.048 Kb Blok RAM, providing the necessary bandwidth for deep FIFO buffering and high-resolution video frame storage, minimizing the need for external SRAM.
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Özel DSP Gücü: ile entegre 96 XtremeDSP™ slices, capable of handling arithmetic-intensive tasks like 3D image reconstruction and complex digital filtering at high clock frequencies.
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Signal & Power Integrity: Bu FFG1513 Flip-Chip BGA package is designed with a dense grid of power and ground pins to minimize Simultaneous Switching Noise (SSN), ensuring clean signal eyes even under high toggle rates.
Teknik Özellikler Matrisi
| Özellik | Şartname |
| Mantık Hücreleri | 200,448 |
| Yapılandırılabilir Mantık Blokları (CLB'ler) | 22,512 |
| Toplam Blok RAM | 6,048 Kb |
| DSP48 Dilimleri | 96 |
| Maksimum Kullanıcı G/Ç | 960 |
| Hız Sınıfı | -10 (Standart Performans) |
| Paket | FFG1513 (Kurşunsuz Flip-Chip BGA) |
| Çalışma Sıcaklığı | Ticari (0°C ila +85°C) |
The Hardware Architect’s Perspective: Why Specify the LX200-10C?
1. Eliminating Multi-Chip Latency
In large-scale designs, partitioning logic across two smaller FPGAs introduces significant timing penalties due to chip-to-chip interconnects. The LX200 allows you to keep your entire critical path on a single die, drastically simplifying timing closure and PCB routing.
2. Robust Thermal Management
Despite its massive logic count, the FFG (Lead-Free) Flip-Chip package provides excellent thermal conductivity. This allows for direct-contact cooling solutions, ensuring the device remains stable even when logic utilization approaches 90%.
3. Long-Term Reliability and Toolchain Maturity
The Virtex-4 LX200 is a mature, proven platform. Its timing models are rock-solid, and the development ecosystem is highly stable, making it a “low-risk” choice for high-value commercial systems that require a 10+ year deployment lifecycle.
Birincil Uygulamalar
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High-Performance Computing: Hardware acceleration for financial modeling and genomic research.
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Broadcasting & Pro-AV: 4K/8K real-time video processing and format conversion.
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Tıbbi Sistemler: High-speed data acquisition for CT/MRI scanners.
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ASIC/SoC Prototyping: Large-scale logic verification and emulation.
