| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX200-10FFG1513C | Virtex-4 LX | 22.272,00 | -10,00 | 200448 | 6193152 | 960 | 1,14 V ~ 1,26 V | Lắp đặt bề mặt | 0 °C ~ +85 °C (Dùng trong thương mại) | 1513-BBGA (FCBGA) | 1513-FCBGA |
XC4VLX200-10FFG1513C: The Ultimate Logic Density for Large-Scale System Integration
The XC4VLX200-10FFG1513C is the flagship high-capacity FPGA within Xilinx’s Virtex®-4 LX family. It is engineered for hardware architects who require massive programmable logic resources without moving to multi-chip partitions. Built on the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, the LX200 provides a staggering 200.448 ô logic, making it the definitive choice for high-end commercial applications such as ASIC prototyping, medical imaging, and complex network switching fabrics.
Điều này Commercial-grade (0°C to +85°C) device, featuring the -10 bậc độ dốc, offers the industry’s most balanced logic-to-cost ratio for high-gate-count designs.
Những điểm nổi bật chính về lĩnh vực Kỹ thuật
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Maximum Logic Capacity: With over 200k logic cells, the LX200 allows for the consolidation of entire system-on-chip (SoC) designs, including multiple MicroBlaze™ processors and extensive custom RTL, into a single device.
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Industry-Leading I/O Count: Tọa lạc tại Gói FFG1513, this FPGA breaks out 960 cổng I/O người dùng. This massive I/O density is critical for interfacing with wide parallel buses, dual-bank DDR2 memory, and high-width backplanes.
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Deep Memory Resources: Tính năng 6,048 Kb of Block RAM, providing the necessary bandwidth for deep FIFO buffering and high-resolution video frame storage, minimizing the need for external SRAM.
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Dedicated DSP Power: Tích hợp với 96 XtremeDSP™ slices, capable of handling arithmetic-intensive tasks like 3D image reconstruction and complex digital filtering at high clock frequencies.
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Signal & Power Integrity: The FFG1513 Flip-Chip BGA package is designed with a dense grid of power and ground pins to minimize Simultaneous Switching Noise (SSN), ensuring clean signal eyes even under high toggle rates.
Bảng thông số kỹ thuật
| Tính năng | Thông số kỹ thuật |
| Tế bào logic | 200,448 |
| Khối logic có thể cấu hình (CLB) | 22,512 |
| Tổng dung lượng RAM khối | 6.048 KB |
| Các nhóm nhỏ của DSP48 | 96 |
| Dung lượng I/O tối đa của người dùng | 960 |
| Đánh giá tốc độ | -10 (Standard Performance) |
| Gói | FFG1513 (BGA chip lật không chì) |
| Nhiệt độ hoạt động | Thương mại (0°C đến +85°C) |
The Hardware Architect’s Perspective: Why Specify the LX200-10C?
1. Eliminating Multi-Chip Latency
In large-scale designs, partitioning logic across two smaller FPGAs introduces significant timing penalties due to chip-to-chip interconnects. The LX200 allows you to keep your entire critical path on a single die, drastically simplifying timing closure and PCB routing.
2. Robust Thermal Management
Despite its massive logic count, the FFG (Lead-Free) Flip-Chip package provides excellent thermal conductivity. This allows for direct-contact cooling solutions, ensuring the device remains stable even when logic utilization approaches 90%.
3. Long-Term Reliability and Toolchain Maturity
The Virtex-4 LX200 is a mature, proven platform. Its timing models are rock-solid, and the development ecosystem is highly stable, making it a “low-risk” choice for high-value commercial systems that require a 10+ year deployment lifecycle.
Primary Applications
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High-Performance Computing: Hardware acceleration for financial modeling and genomic research.
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Broadcasting & Pro-AV: 4K/8K real-time video processing and format conversion.
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Hệ thống y tế: High-speed data acquisition for CT/MRI scanners.
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ASIC/SoC Prototyping: Large-scale logic verification and emulation.
