XC4VLX100-10FF1148C

Üretici firma: Xilinx
Mantık Hücreleri: 110,592
Mantık Dilimleri: 49,152 (yaklaşık)
Gömülü RAM (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FF1148 (Fine-Pitch BGA)
Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC4VLX100-10FF1148C Virtex-4 LX 11.520,00 -10,00 99840 4478976 768 1,14 V ~ 1,26 V Yüzey Montajı 0 °C ~ +85 °C (Ticari) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-10FF1148C: High-Density Logic Consolidation for Commercial Computing Platforms

    Bu XC4VLX100-10FF1148C is a high-capacity FPGA within Xilinx’s legendary Virtex®-4 LX family, specifically engineered for logic-intensive commercial applications. Utilizing the revolutionary 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) mimarisi sayesinde, bu cihaz büyük bir 110.592 Mantık Hücresi fabric. It is the definitive choice for architects who need to consolidate complex system-level functions—such as multiple soft-core processors, high-bandwidth memory controllers, and extensive custom RTL—into a single, high-reliability silicon footprint.

    Operating at a Commercial-grade (0°C to +85°C) temperature range with a -10 hız derecesi, it offers a balanced solution for high-end digital signal processing and massive parallel data routing.

    Temel Mühendislikte Öne Çıkanlar

    • Architectural Efficiency: The ASMBL architecture allows for a highly uniform distribution of logic, memory, and DSP columns. This reduces routing congestion, a critical advantage when designing high-utilization systems that exceed 80% logic occupancy.

    • Zengin Bellek Hiyerarşisi: Özellikler 4.320 Kb Blok RAM (BRAM). This dual-port memory resources are essential for implementing deep data buffers, localized caching, and high-speed FIFO structures required in streaming video or networking applications.

    • Massive I/O Connectivity: Evin içinde FF1148 Flip-Chip BGA package, the device breaks out 768 Kullanıcı I/O'ları. This allows for the simultaneous management of high-width parallel buses, such as dual-bank DDR2 or QDR-II interfaces, without pin-count bottlenecks.

    • XtremeDSP™ Performance: ile entegre 96 özel DSP48 dilimi. These hard-coded arithmetic blocks handle 18×18 bit multiplications and MAC functions at hardware speeds, freeing up standard logic for control plane tasks.

    • Precision Clocking (DCM): Equipped with advanced Digital Clock Managers for sub-nanosecond skew control and frequency synthesis, ensuring stable synchronization across complex, multi-clock domain designs.


    Teknik Özellikler Matrisi

    Özellik Şartname
    Mantık Hücreleri 110,592
    CLB Dizisi 12,480
    Toplam Blok RAM 4,320 Kb
    DSP48 Dilimleri 96
    Kullanıcı I/O'ları 768
    Hız Sınıfı -10 (Standart Performans)
    Sıcaklık Sınıfı Ticari (0°C ila +85°C)
    Paket FF1148 (Flip-Chip BGA)

    Hardware Architect’s Perspective: Why Specify the LX100-10C?

    1. Öngörülebilir Zamanlamalı Kapatma

    One of the primary reasons engineers stay with the Virtex-4 LX100 is its predictable routing fabric. Unlike newer, more congested architectures, the LX100 provides consistent timing models that allow for faster design iterations and “right-the-first-time” silicon behavior.

    2. Üstün Sinyal Bütünlüğü

    Bu FF1148 Flip-Chip package is specifically designed to minimize parasitic inductance. With a dense distribution of VCC and GND pins, it suppresses Eşzamanlı Anahtarlama Gürültüsü (SSN), ensuring clean signal eyes for high-speed differential pairs (LVDS/HSTL).

    3. Maturity and Stability

    For commercial products with long lifecycles—such as medical imaging backplanes or high-end broadcasting gear—the LX100-10C offers a proven track record of field reliability and a well-documented toolchain, reducing the risk of unexpected architectural bugs.


    Ideal Use Cases

    • Broadcasting: Real-time format conversion and professional-grade video switching.

    • Tıbbi Sistemler: Advanced MRI data acquisition and real-time image reconstruction.

    • Test ve Ölçüm: Logic analyzer front-ends and high-speed pattern generation.

    • İletişim: Yüksek hızlı protokol dönüşümü ve yerelleştirilmiş anahtarlama kumaşları.