XCVU47P-2FSVH2892E

Part Number Full Interpretation

1. XCVU47P: Core model, Virtex UltraScale+ series high-bandwidth computing FPGA with integrated HBM2 high-bandwidth memory
2. -2: Speed Grade 2, mainstream high-performance timing grade, balanced speed and power consumption
3. FSVH2892: 2892-ball flip-chip FCBGA package, outline dimension 55mm × 55mm
4. E: Extended industrial temperature grade, operating junction temperature range: -40℃ ~ +100℃

Core On-Chip Hardware Resource Parameters

Logic & Arithmetic Computing Resources

• Total Logic Cells: 2,851,800
• Configurable ALM Logic Modules: 162,960
• DSP48E2 arithmetic slices: 9,024 units, supporting 27×18-bit multiply-accumulate operations, oriented to AI inference, radar signal processing, massive matrix calculation, digital filtering intensive computing tasks

On-Chip Storage & HBM2 High Bandwidth Memory

• Total Block RAM + UltraRAM total capacity: 74.34 Mbit
• Equipped with on-package HBM2 memory stack, ultra-wide bus architecture, providing terabyte-level memory bandwidth, eliminating external memory access bottlenecks for large data streaming
• Distributed RAM composed of internal LUT resources for low-latency small-capacity data caching

Clock Management Modules

High-Speed Serial Transceivers & General I/O

• 96-channel GTY high-speed differential transceivers, maximum single-channel rate up to 32.75 Gbps

  Compatible protocols: PCIe Gen5, 100G/400G Ethernet, Interlaken, Serial RapidIO, high-speed inter-chip interconnection

• Total available user general I/O pins: 624
• Supports LVCMOS, LVDS, differential signaling and various high-speed electrical standards

Integrated Hardened IP Cores

Power Supply Specifications

• Core logic nominal voltage: 0.85V
• Multiple independent power domains support dynamic voltage and frequency scaling to flexibly adjust power consumption according to load
• Typical full-load power consumption: 130W ~ 160W, matched with forced air cooling or liquid cooling heat dissipation scheme

Packaging & SMT Assembly Requirements

• Package: 2892-pin flip-chip FCBGA surface mount package, body size 55mm × 55mm
• Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
• Fully lead-free packaging, compliant with global RoHS environmental directives
• Standard shipping: anti-static tray packaging for large-scale automated industrial PCB assembly

Environmental & Safety Features

• Extended temperature grade: stable continuous operation from -40℃ to +100℃ junction temperature, adaptable to outdoor communication equipment, vehicle-mounted computing platforms, aerospace and military electronic systems under severe temperature changes and strong electromagnetic interference
• 256-bit AES bitstream encryption, anti-tampering design to protect hardware algorithm intellectual property
• Supports partial dynamic reconfiguration, SEU radiation error correction, high reliability for long-term uninterrupted operation

Типичные области применения

1. High-end network acceleration cards: 100G/400G Ethernet switching, network packet processing, data center traffic offloading
2. Artificial intelligence edge reasoning acceleration: image recognition, video decoding, multi-modal algorithm hardware acceleration
3. Radar, electronic warfare, communication base station large-scale baseband signal processing systems
4. High-speed data acquisition & high-precision test instruments: oscilloscopes, spectrum analyzers, transient signal recording equipment
5. Aerospace remote sensing data processing, onboard high-performance embedded computing platforms
6. Custom high-bandwidth HBM computing acceleration boards, large-scale parallel signal processing arrays