XCVU47P-2FSVH2892E
Nhà sản xuất: AMD (Xilinx)
Các tế bào logic hệ thống: 2,857,000
UltraRAM: 270 MB
Gói: FSVH2892
Nhiệt độ hoạt động: Phạm vi nhiệt độ mở rộng (-40°C đến +100°C)
Thông số kỹ thuật
Part Number Full Interpretation
This is AMD Virtex UltraScale+ flagship high-performance FPGA, fabricated on 16nm FinFET advanced process.
- XCVU47P: Core model, Virtex UltraScale+ series high-bandwidth computing FPGA with integrated HBM2 high-bandwidth memory
- -2: Speed Grade 2, mainstream high-performance timing grade, balanced speed and power consumption
- FSVH2892: 2892-ball flip-chip FCBGA package, outline dimension 55mm × 55mm
- E: Extended industrial temperature grade, operating junction temperature range: -40℃ ~ +100℃
Core On-Chip Hardware Resource Parameters
Logic & Arithmetic Computing Resources
- Total Logic Cells: 2,851,800
- Configurable ALM Logic Modules: 162,960
- DSP48E2 arithmetic slices: 9,024 units, supporting 27×18-bit multiply-accumulate operations, oriented to AI inference, radar signal processing, massive matrix calculation, digital filtering intensive computing tasks
On-Chip Storage & HBM2 High Bandwidth Memory
- Total Block RAM + UltraRAM total capacity: 74.34 Mbit
- Equipped with on-package HBM2 memory stack, ultra-wide bus architecture, providing terabyte-level memory bandwidth, eliminating external memory access bottlenecks for large data streaming
- Distributed RAM composed of internal LUT resources for low-latency small-capacity data caching
Mô-đun quản lý đồng hồ
Multiple MMCM and PLL clock management tiles are integrated inside the chip. It supports clock multiplication, division, arbitrary phase offset adjustment, jitter suppression and multi-clock domain dynamic switching, meeting complex timing requirements of high-speed digital systems.
High-Speed Serial Transceivers & General I/O
- 96-channel GTY high-speed differential transceivers, maximum single-channel rate up to 32.75 Gbps
Compatible protocols: PCIe Gen5, 100G/400G Ethernet, Interlaken, Serial RapidIO, high-speed inter-chip interconnection
- Total available user general I/O pins: 624
- Supports LVCMOS, LVDS, differential signaling and various high-speed electrical standards
Integrated Hardened IP Cores
Built-in dedicated hard macro IP blocks: PCIe Gen4/Gen5 controller, 100G Ethernet MAC, AXI4 high-speed bus, memory controller, greatly reducing logic resource occupation and development difficulty.
Thông số kỹ thuật bộ nguồn
- Core logic nominal voltage: 0.85V
- Multiple independent power domains support dynamic voltage and frequency scaling to flexibly adjust power consumption according to load
- Typical full-load power consumption: 130W ~ 160W, matched with forced air cooling or liquid cooling heat dissipation scheme
Yêu cầu về đóng gói và lắp ráp SMT
- Package: 2892-pin flip-chip FCBGA surface mount package, body size 55mm × 55mm
- Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
- Fully lead-free packaging, compliant with global RoHS environmental directives
- Standard shipping: anti-static tray packaging for large-scale automated industrial PCB assembly
Environmental & Safety Features
- Extended temperature grade: stable continuous operation from -40℃ to +100℃ junction temperature, adaptable to outdoor communication equipment, vehicle-mounted computing platforms, aerospace and military electronic systems under severe temperature changes and strong electromagnetic interference
- 256-bit AES bitstream encryption, anti-tampering design to protect hardware algorithm intellectual property
- Supports partial dynamic reconfiguration, SEU radiation error correction, high reliability for long-term uninterrupted operation
Các lĩnh vực ứng dụng điển hình
- High-end network acceleration cards: 100G/400G Ethernet switching, network packet processing, data center traffic offloading
- Artificial intelligence edge reasoning acceleration: image recognition, video decoding, multi-modal algorithm hardware acceleration
- Radar, electronic warfare, communication base station large-scale baseband signal processing systems
- High-speed data acquisition & high-precision test instruments: oscilloscopes, spectrum analyzers, transient signal recording equipment
- Aerospace remote sensing data processing, onboard high-performance embedded computing platforms
- Custom high-bandwidth HBM computing acceleration boards, large-scale parallel signal processing arrays
