| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K355T-2FFG901E | Kintex-7 | 27.825,00 | -2,00 | 356,160 | 26357760 | 300 | 0,97 V ~ 1,03 V | Монтаж на поверхность | 0 °C ~ +100 °C (E) | 901-FCBGA (FFG901) | 901-FCBGA (31×31) |
XC7K355T-2FFG901E
Производитель: Xilinx
Логические ячейки: 354,720
Логические срезы: 55,425
Встроенная оперативная память (eRAM): 32,400 Kb (900 × 36Kb Block RAM)
Максимальный пользовательский ввод/вывод: 400
Упаковка: FFG901 (Flip-Chip BGA)
Класс скорости: -2
Рабочая температура: Расширенный (от 0°C до +100°C)
Технические характеристики
Определение номера детали
This extended commercial temperature FPGA belongs to AMD Xilinx Kintex‑7 family, fabricated on mature 28nm HKMG semiconductor process with unified 7‑series architecture. It balances operating frequency, power consumption and hardware cost, designed for indoor server communication equipment, laboratory signal test instruments, stationary industrial video processing systems and wired transmission devices working under stable room temperature environments.
- XC7K355T: Mid‑large capacity mainstream device of Kintex‑7 series, widely deployed in wireless baseband processing, digital signal analysis and industrial control systems with excellent cost‑performance ratio
- -2: Speed Grade 2, balanced timing specification. It strikes the middle point between maximum operating frequency and power dissipation, suitable for indoor continuous running equipment that needs stable high‑speed operation without extreme clock pursuit
- FFG901: 901‑ball flip‑chip FCBGA package with dimension 31mm × 31mm. The package provides outstanding thermal dissipation performance and signal integrity; sufficient pins fully support layout of all integrated GTX transceivers, general‑purpose I/O banks and multi‑channel DDR3 memory interfaces
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
On‑Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 356,160
- Configurable CLB Slices: 55,650
- Total Flip‑Flops: 1,113,000
- Total LUT Lookup Tables: 556,500
- Distributed RAM Capacity: 5.09 Mb
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 1,440 units, used for fixed‑point and floating‑point computing, large‑scale FFT spectrum analysis, wireless communication baseband demodulation, radar echo signal processing and lightweight encryption algorithm acceleration
- Total Block RAM Capacity: 25.74 Mb, applied to image frame buffering, deep FIFO data cache, waveform raw data storage and algorithm parameter table storage
3. Clock Management Subsystem
- 10 MMCM clock management tiles
- 10 PLL phase‑locked loops
Multiple independent clock domains can be configured freely. The system realizes accurate clock phase adjustment, transmission delay compensation and low‑jitter clock generation, satisfying strict synchronous timing requirements of medium‑scale communication and digital signal processing systems
4. High‑Speed Serial Transceivers
- 24 GTX differential high‑speed serial transceivers
Maximum single lane rate reaches 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial high‑speed serial protocols. Built‑in hard protocol controllers shorten the development cycle of high‑bandwidth data transmission interfaces
5. I/O Interfaces & On‑Chip Monitoring Module
- Total configurable user I/O pins: 300
Multiple I/O voltage banks cover 1.2V ~ 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single‑ended & differential signal standards
Dual 12‑bit XADC monitoring module continuously collects real‑time data of chip junction temperature, internal core supply voltages and external analog input signals
Power Supply Characteristics
Core operating voltage for Speed Grade 2 ranges from 0.97V to 1.03V. Programmable logic fabric, Block RAM, DSP arrays and serial transceivers are divided into independent power domains, supporting partial module power gating to dynamically reduce overall power consumption
Typical total power consumption range: 13W ~ 35W. Continuous full‑load operation at upper temperature limit requires forced air cooling configuration
Packaging and SMT Assembly Specifications
- Package Form: 901‑pin Flip‑Chip BGA
- Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be finished within 72 hours after vacuum packaging is opened
- Lead‑free packaging design, fully compliant with RoHS3 environmental standards
- Chips are stored and transported in anti‑static trays to avoid electrostatic damage during mass PCB assembly
Environmental Adaptability and Operational Reliability
This chip is designed for constant indoor temperature environments. It runs stably long‑term under mild temperature fluctuations, slight mechanical vibration and conventional electromagnetic interference. It supports AES 256 bitstream encryption, dynamic partial reconfiguration and SEU single‑event upset detection & correction. Without radiation‑hardened reinforcement, it cannot work reliably under outdoor low temperature and harsh rugged working conditions
Типичные сценарии применения
- Low‑density 10G optical communication line cards and enterprise server room auxiliary switching control boards
- Desktop spectrum analyzers, arbitrary waveform generators and multi‑channel high‑speed data acquisition instruments for electronic laboratories
- Industrial 4K real‑time video codec equipment and medium‑precision machine vision image processing platforms
- Small & medium‑scale communication chip prototype verification and wireless algorithm development platforms for universities and research institutes
- Indoor industrial high‑speed data gateways and desktop lightweight cryptographic acceleration hardware
