| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-11FFG668C | Virtex-4 SX | 2.688,00 | -11,00 | 24192 Логические элементы | 1 327 104 бит | 448 | 1,14 V ~ 1,26 V | Монтаж на поверхность | Коммерческий (0°C ~ +85°C) | 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX25-11FFG668C: High-Speed Virtex-4 LX Logic Platform
Сайт XC4VLX25-11FFG668C is a high-performance FPGA within the Virtex-4 LX family, optimized for logic-heavy applications that demand tighter timing margins. Utilizing the 90nm process, the LX series focuses on maximizing logic-to-feature ratios, making it the preferred choice for high-speed I/O interfacing, frame buffering, and complex state machine implementations.
As a -11 класс скорости device, this variant offers a performance boost over the standard -10, providing the necessary slack for designs running at higher clock frequencies or those with complex routing paths that are sensitive to propagation delays.
Core Technical Parameters
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Логические ячейки: 24,192
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Max Clock Management Tiles (CMTs): 8 (Incorporating DCMs and PMCDs)
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Блок оперативной памяти: 1,296 Kb
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DSP48 Slices: 48
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Max User I/O: 448
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Упаковка: FFG668 (Fine-pitch Flip-Chip BGA, Pb-Free)
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Класс скорости: -11 (высокая производительность)
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Температурный класс: Commercial ($0°C$ на $+85°C$)
Инженерная реализация и проектные заметки
When integrating the XC4VLX25-11FFG668C into an existing system or a new legacy-support design, keep these hardware-level factors in mind:
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Timing Closure: The -11 speed grade is approximately 10-15% faster than the -10. While this aids in meeting setup times ($T_{su}$), engineers should perform a secondary static timing analysis (STA) to ensure that hold time ($T_h$) violations haven’t been introduced in short paths due to the faster silicon.
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Configuration Requirements: This device requires a 1.2V $V_{CCINT}$ supply. Ensure your power distribution network (PDN) is decoupled correctly with low-ESR capacitors near the FFG668 footprint to manage the transient currents typical of high-speed switching in the Virtex-4 architecture.
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ISE Design Suite: Note that the Virtex-4 family is не поддерживается Vivado. Вы должны использовать Xilinx ISE 14.7. If you are pulling an archived project, ensure your constraints file (.UCF) is mapped correctly to the 668-pinout to avoid I/O bank voltage conflicts.
Why Sourcing the -11 Grade Matters
In many medical and defense systems, the XC4VLX25-11FFG668C was specified because the design would not “lock” at the -10 speed grade. Replacing a -11 with a -10 can lead to intermittent system crashes or bit errors. We prioritize providing the exact speed grade specified in your original netlist to maintain system integrity.
Часто задаваемые вопросы инженера по аппаратному обеспечению
Can I use a -12 speed grade instead of this -11? Technically, yes. Xilinx speed grades are backward compatible; a faster part (-12) can always do the job of a slower part (-11), provided the thermal envelope remains within limits. However, the -11 is usually the “sweet spot” for cost vs. performance in maintenance cycles.
Does the FFG668 package require specialized soldering? The “FFG” signifies a Lead-Free Flip-Chip BGA. It requires a standard RoHS reflow profile. Because the die is mounted directly to the substrate (Flip-Chip), the package has excellent heat dissipation through the top of the chip, but it is sensitive to uneven mechanical pressure from heatsinks.
How do I handle the EOL (End of Life) status of this part? The Virtex-4 is a mature product. When sourcing, we recommend requesting the specific Date Code (D/C) and ensuring the parts have been stored in MSL-compliant (Moisture Sensitivity Level) packaging to prevent popcorn effects during reflow.
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