XC4VLX25-11FFG668C

제조업체: 자일링스
로직 셀: 24,576
로직 슬라이스: 1,536
임베디드 RAM(eRAM): 1,105,920비트
패키지: FFG668
작동 온도: 상업용(0°C ~ +85°C)

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC4VLX25-11FFG668C Virtex-4 SX 2.688,00 -11,00 24192 논리 요소 1,327,104비트 448 1.14V ~ 1.26V 표면 실장 상업용(0°C ~ +85°C) 668-BBGA, FCBGA 668-FCBGA(27×27)

    XC4VLX25-11FFG668C: High-Speed Virtex-4 LX Logic Platform

    그리고 XC4VLX25-11FFG668C is a high-performance FPGA within the Virtex-4 LX family, optimized for logic-heavy applications that demand tighter timing margins. Utilizing the 90nm process, the LX series focuses on maximizing logic-to-feature ratios, making it the preferred choice for high-speed I/O interfacing, frame buffering, and complex state machine implementations.

    As a -11 속도 등급 device, this variant offers a performance boost over the standard -10, providing the necessary slack for designs running at higher clock frequencies or those with complex routing paths that are sensitive to propagation delays.

    Core Technical Parameters

    • 로직 셀: 24,192

    • 최대 클럭 관리 타일(CMT): 8 (Incorporating DCMs and PMCDs)

    • RAM을 차단합니다: 1,296 Kb

    • DSP48 슬라이스: 48

    • 최대 사용자 I/O: 448

    • 패키지: FFG668 (Fine-pitch Flip-Chip BGA, Pb-Free)

    • 속도 등급: -11(고성능)

    • 온도 등급: Commercial ($0°C$$+85°C$)

    Engineering Implementation & Design Notes

    When integrating the XC4VLX25-11FFG668C into an existing system or a new legacy-support design, keep these hardware-level factors in mind:

    1. 타이밍 종료: The -11 speed grade is approximately 10-15% faster than the -10. While this aids in meeting setup times ($T_{su}$), engineers should perform a secondary static timing analysis (STA) to ensure that hold time ($T_h$) violations haven’t been introduced in short paths due to the faster silicon.

    2. Configuration Requirements: This device requires a 1.2V $V_{CCINT}$ supply. Ensure your power distribution network (PDN) is decoupled correctly with low-ESR capacitors near the FFG668 footprint to manage the transient currents typical of high-speed switching in the Virtex-4 architecture.

    3. ISE Design Suite: Note that the Virtex-4 family is not supported by Vivado. You must use 자일링스 ISE 14.7. If you are pulling an archived project, ensure your constraints file (.UCF) is mapped correctly to the 668-pinout to avoid I/O bank voltage conflicts.

    Why Sourcing the -11 Grade Matters

    In many medical and defense systems, the XC4VLX25-11FFG668C was specified because the design would not “lock” at the -10 speed grade. Replacing a -11 with a -10 can lead to intermittent system crashes or bit errors. We prioritize providing the exact speed grade specified in your original netlist to maintain system integrity.

    하드웨어 엔지니어를 위한 FAQ

    Can I use a -12 speed grade instead of this -11? Technically, yes. Xilinx speed grades are backward compatible; a faster part (-12) can always do the job of a slower part (-11), provided the thermal envelope remains within limits. However, the -11 is usually the “sweet spot” for cost vs. performance in maintenance cycles.

    Does the FFG668 package require specialized soldering? The “FFG” signifies a Lead-Free Flip-Chip BGA. It requires a standard RoHS reflow profile. Because the die is mounted directly to the substrate (Flip-Chip), the package has excellent heat dissipation through the top of the chip, but it is sensitive to uneven mechanical pressure from heatsinks.

    How do I handle the EOL (End of Life) status of this part? The Virtex-4 is a mature product. When sourcing, we recommend requesting the specific Date Code (D/C) and ensuring the parts have been stored in MSL-compliant (Moisture Sensitivity Level) packaging to prevent popcorn effects during reflow.

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