사양
부품 번호 분석
This is AMD Xilinx Zynq UltraScale+ MPSoC heterogeneous system-on-chip manufactured on 16nm FinFET process, combining ARM processing subsystem and programmable FPGA logic, without built-in RF analog converters, for embedded control, vision and general signal processing applications.
- XCZU5EG: Entry-level Zynq UltraScale+ MPSoC device
- -1: Speed Grade 1, baseline timing specification
- SFVC784: 784-ball FCBGA flip-chip package
- I: Industrial temperature grade, junction temperature operating range: -40°C ~ +100°C
Full On-Chip Hardware Architecture
1. Processing System (PS Side, ARM Domain)
- Quad-core Cortex-A53 application processors for Linux system operation, application scheduling and network protocol processing
- Dual-core Cortex-R5F real-time cores for low-latency control tasks, fault monitoring and safety-critical applications
- Integrated Mali-400 MP2 graphics processing unit for display output and lightweight graphical rendering
- Hardware video codec engine supporting multi-channel video encoding and decoding
- Rich peripheral interfaces: Gigabit Ethernet, USB 3.0, SD/eMMC, CAN, UART, SPI, I2C, GPIO
- On-chip security module supporting secure boot, AES bitstream encryption and anti-tampering protection
2. Programmable Logic Fabric (PL Side, FPGA Domain)
- Total Logic Cells: 154,000
- DSP48E2 arithmetic blocks: 720 units, used for digital filtering, FFT calculation, image preprocessing and algorithm acceleration
- Total Block RAM + UltraRAM capacity: 9.2 Mb
- Multiple MMCM and PLL clock management tiles to realize clock multiplication, division, phase shifting and jitter filtering for multi-clock domain systems
- Configurable general I/O banks supporting LVCMOS, LVDS and mainstream differential electrical standards
3. High-Speed Serial Transceivers
8 GTY high-speed serial lanes, maximum single-channel rate up to 16.375 Gbps, compatible with PCIe Gen3, Gigabit Ethernet, high-speed serial inter-chip transmission protocols
전원 공급 장치 사양
Multiple independent power domains are assigned to processor system, programmable logic and transceivers. Typical core voltage is 0.85V, dynamic voltage and frequency adjustment is supported to optimize power consumption under different loads.
Typical overall power consumption ranges from 7W to 22W, applicable to passive heat sink cooling for compact embedded devices.
Packaging & Assembly Specifications
- Package type: 784-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3. Reflow soldering must be completed within 168 hours after vacuum packaging is unsealed
- 무연 구조로, RoHS 환경 규정을 완벽하게 준수합니다.
- Supplied in anti-static trays for automated industrial PCB mass production
Environmental and Reliability Features
Stable long-term operation under drastic temperature fluctuation and strong electromagnetic interference conditions.
Equipped with SEU error correction, partial dynamic reconfiguration and redundant real-time core functions, meeting high reliability requirements for industrial control, vehicle electronics and outdoor embedded equipment.
일반적인 애플리케이션 시나리오
- Industrial automation controllers, servo drive main control units and factory field gateway equipment
- Embedded machine vision: industrial camera image acquisition, defect detection and visual inspection terminals
- On-board intelligent computing, vehicle-mounted display and automotive domain control modules
- Portable data recorders, vibration monitoring instruments and general signal acquisition equipment
- Intelligent surveillance edge computing nodes, mini embedded gateway devices
- Medical portable diagnostic equipment front-end control and signal processing boards
