XCZU5EG-1SFVC784I
الشركة المصنعة: AMD (Xilinx)
System Logic Cells: 143,000
كتلة ذاكرة الوصول العشوائي (RAM): 7,560 Kb
UltraRAM: 13.5 Mb
الحزمة: SFVC784
درجة حرارة التشغيل: صناعي (-40 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تفصيل أرقام القطع
This is AMD Xilinx Zynq UltraScale+ MPSoC heterogeneous system-on-chip manufactured on 16nm FinFET process, combining ARM processing subsystem and programmable FPGA logic, without built-in RF analog converters, for embedded control, vision and general signal processing applications.
- XCZU5EG: Entry-level Zynq UltraScale+ MPSoC device
- -1: Speed Grade 1, baseline timing specification
- SFVC784: 784-ball FCBGA flip-chip package
- I: فئة درجات الحرارة الصناعية، نطاق تشغيل درجة حرارة الوصلة: -40 درجة مئوية ~ +100 درجة مئوية
بنية أجهزة كاملة مدمجة على الرقاقة
1. Processing System (PS Side, ARM Domain)
- Quad-core Cortex-A53 application processors for Linux system operation, application scheduling and network protocol processing
- Dual-core Cortex-R5F real-time cores for low-latency control tasks, fault monitoring and safety-critical applications
- Integrated Mali-400 MP2 graphics processing unit for display output and lightweight graphical rendering
- Hardware video codec engine supporting multi-channel video encoding and decoding
- Rich peripheral interfaces: Gigabit Ethernet, USB 3.0, SD/eMMC, CAN, UART, SPI, I2C, GPIO
- On-chip security module supporting secure boot, AES bitstream encryption and anti-tampering protection
2. البنية المنطقية القابلة للبرمجة (جانب PL، مجال FPGA)
- Total Logic Cells: 154,000
- DSP48E2 arithmetic blocks: 720 units, used for digital filtering, FFT calculation, image preprocessing and algorithm acceleration
- Total Block RAM + UltraRAM capacity: 9.2 Mb
- Multiple MMCM and PLL clock management tiles to realize clock multiplication, division, phase shifting and jitter filtering for multi-clock domain systems
- Configurable general I/O banks supporting LVCMOS, LVDS and mainstream differential electrical standards
3. High-Speed Serial Transceivers
8 GTY high-speed serial lanes, maximum single-channel rate up to 16.375 Gbps, compatible with PCIe Gen3, Gigabit Ethernet, high-speed serial inter-chip transmission protocols
مواصفات مصدر الطاقة
Multiple independent power domains are assigned to processor system, programmable logic and transceivers. Typical core voltage is 0.85V, dynamic voltage and frequency adjustment is supported to optimize power consumption under different loads.
Typical overall power consumption ranges from 7W to 22W, applicable to passive heat sink cooling for compact embedded devices.
Packaging & Assembly Specifications
- Package type: 784-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3. Reflow soldering must be completed within 168 hours after vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental regulations
- Supplied in anti-static trays for automated industrial PCB mass production
Environmental and Reliability Features
Stable long-term operation under drastic temperature fluctuation and strong electromagnetic interference conditions.
Equipped with SEU error correction, partial dynamic reconfiguration and redundant real-time core functions, meeting high reliability requirements for industrial control, vehicle electronics and outdoor embedded equipment.
سيناريوهات التطبيق النموذجية
- Industrial automation controllers, servo drive main control units and factory field gateway equipment
- Embedded machine vision: industrial camera image acquisition, defect detection and visual inspection terminals
- On-board intelligent computing, vehicle-mounted display and automotive domain control modules
- Portable data recorders, vibration monitoring instruments and general signal acquisition equipment
- Intelligent surveillance edge computing nodes, mini embedded gateway devices
- Medical portable diagnostic equipment front-end control and signal processing boards
