| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU7P-1FLVC2104I | 버텍스® 울트라스케일+/울트라스케일 제품군 MPN(XCVU7P) | 98,52 | -1,00 | 1,724,100 LE | ~506 00000비트 | 884 | 0.850 V | SMD/FBGA | -40°C ~ +100°C | FBGA-2104 | 2104-FCBGA |
사양
부품 번호 정의
This industrial temperature low-power FPGA belongs to Virtex UltraScale+ family, manufactured with 16nm FinFET advanced process technology. The whole chip adopts power-enhanced UltraScale+ architecture, balancing programmable logic, high-precision arithmetic units, on-chip storage and high-speed serial transceivers. It is tailored for outdoor industrial acquisition equipment, vehicle-mounted embedded computing terminals, miniaturized airborne payload modules and portable field test instruments requiring reliable continuous operation across full industrial temperature range.
- XCVU7P: Mid-capacity power-optimized device in Virtex UltraScale+ lineup. The suffix P stands for power optimized version, which greatly reduces static power consumption and optimizes internal interconnection delay compared with standard models
- -1: Speed Grade 1, low-power priority timing grade. Thermal stability and power saving are primary design objectives rather than maximum operating clock frequency, suitable for long-running hardware with limited heat dissipation space and battery-powered devices
- FLVC2104: 2104-ball flip-chip FCBGA package with physical dimension 47.5mm × 47.5mm. Reserved pins support complete layout of all integrated high-speed transceivers, general-purpose I/O wiring and multi-channel DDR4 memory interface connection while controlling equipment overall volume
- I: Industrial temperature rating, continuous junction temperature working range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 1724100
- Configurable CLB Slices: 98520
- Total Flip-Flops: 1970400
- Total LUT Lookup Tables: 985200
- Distributed RAM Capacity: 11.2 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E3 arithmetic slices: 1024 units, optimized for fixed-point and floating-point computation, large-scale FFT spectrum analysis, communication baseband processing, radar signal modulation and cryptographic algorithm acceleration, applicable to medium matrix calculation tasks
- Total Block RAM Capacity: 38.6 Mb, deployed for image frame buffering, deep FIFO data caching, waveform data storage and algorithm parameter lookup tables
No embedded UltraRAM memory is integrated inside this chip
3. Clock Management Subsystem
- 14 MMCM clock management tiles
- 14 PLL phase-locked loops
Multiple independent clock domains can be freely configured, supporting precise clock phase adjustment, signal transmission delay compensation and ultra-low clock jitter suppression, fully satisfying strict synchronous timing requirements of complex large-scale digital systems
4. 고속 직렬 트랜시버
- 24 GTY differential high-speed transceivers
Each lane maximum transmission rate reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard Ethernet MAC and PCIe controller IP shorten the development cycle of high-bandwidth communication interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 416
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended and differential signal standards
The embedded system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals
Power Supply Characteristics
Core supply voltage for Speed Grade 1 ranges from 0.825V to 0.876V. Programmable logic area, block RAM, DSP arrays and serial transceivers are divided into mutually independent power domains, supporting partial module power gating to dynamically lower overall power consumption
Typical total power consumption ranges from 12W to 41W. For stable full-load continuous operation at upper industrial temperature limit, forced air cooling is mandatory
Packaging and SMT Assembly Specifications
- Package form: 2104-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be finished within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly
Environmental Adaptability and Operational Reliability
The chip maintains long-term stable operation under drastic temperature fluctuation, mechanical shock, vibration and strong electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, with optimized radiation resistance, applicable to aerospace miniature payload equipment, military portable measuring terminals and outdoor industrial field deployment scenarios
일반적인 애플리케이션 시나리오
- Lightweight UAV payload computing boards and miniature airborne signal preprocessing modules
- Compact rugged VPX auxiliary control mainboards for military portable devices
- Portable field spectrum analyzers and outdoor arbitrary waveform signal generators
- Outdoor multi-channel industrial sensor data acquisition and real-time signal processing systems
- Medium-scale chip prototype verification platforms with strict power and space constraints
- Vehicle-mounted intelligent perception preprocessing units and wide-temperature industrial edge gateways
