XCVU7P-1FLVC2104I

تعريف رقم القطعة

1. XCVU7P: Mid-capacity power-optimized device in Virtex UltraScale+ lineup. The suffix P stands for power optimized version, which greatly reduces static power consumption and optimizes internal interconnection delay compared with standard models
2. -1: Speed Grade 1, low-power priority timing grade. Thermal stability and power saving are primary design objectives rather than maximum operating clock frequency, suitable for long-running hardware with limited heat dissipation space and battery-powered devices
3. FLVC2104: 2104-ball flip-chip FCBGA package with physical dimension 47.5mm × 47.5mm. Reserved pins support complete layout of all integrated high-speed transceivers, general-purpose I/O wiring and multi-channel DDR4 memory interface connection while controlling equipment overall volume
4. I: Industrial temperature rating, continuous junction temperature working range: -40°C ~ +100°C

معلمات موارد الأجهزة المدمجة في الرقاقة

1. Programmable Logic Resources

• Total System Logic Cells: 1724100
• Configurable CLB Slices: 98520
• Total Flip-Flops: 1970400
• Total LUT Lookup Tables: 985200
• Distributed RAM Capacity: 11.2 Mb

2. موارد الحساب والذاكرة المدمجة

• DSP48E3 arithmetic slices: 1024 units, optimized for fixed-point and floating-point computation, large-scale FFT spectrum analysis, communication baseband processing, radar signal modulation and cryptographic algorithm acceleration, applicable to medium matrix calculation tasks
• Total Block RAM Capacity: 38.6 Mb, deployed for image frame buffering, deep FIFO data caching, waveform data storage and algorithm parameter lookup tables

  No embedded UltraRAM memory is integrated inside this chip

3. Clock Management Subsystem

• 14 MMCM clock management tiles
• 14 PLL phase-locked loops

  Multiple independent clock domains can be freely configured, supporting precise clock phase adjustment, signal transmission delay compensation and ultra-low clock jitter suppression, fully satisfying strict synchronous timing requirements of complex large-scale digital systems

4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة

• 24 GTY differential high-speed transceivers

  Each lane maximum transmission rate reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard Ethernet MAC and PCIe controller IP shorten the development cycle of high-bandwidth communication interfaces

5. I/O Interfaces and System Monitoring Module

• Configurable user I/O pins: 416

  Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended and differential signal standards

  The embedded system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals

Power Supply Characteristics

Packaging and SMT Assembly Specifications

• Package form: 2104-pin FCBGA flip-chip ball grid array
• Moisture Sensitivity Level: MSL4. All reflow soldering operations must be finished within 72 hours after vacuum packaging is opened
• Lead-free packaging design, fully compliant with RoHS environmental standards
• Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly

Environmental Adaptability and Operational Reliability

سيناريوهات التطبيق النموذجية

1. Lightweight UAV payload computing boards and miniature airborne signal preprocessing modules
2. Compact rugged VPX auxiliary control mainboards for military portable devices
3. Portable field spectrum analyzers and outdoor arbitrary waveform signal generators
4. Outdoor multi-channel industrial sensor data acquisition and real-time signal processing systems
5. Medium-scale chip prototype verification platforms with strict power and space constraints
6. Vehicle-mounted intelligent perception preprocessing units and wide-temperature industrial edge gateways