| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU125-1FLVB2104I | 버텍스® 울트라스케일(XCVU125) | 89,52 | -1,00 | 1,566,600 LE | 90,726,400비트(90.7Mbit) | 832 | ~0.922~0.979V(일반적인 등재 범위) | 표면 실장(BGA/FCBGA) | -40°C ~ +100°C(TJ) | FBGA-2104 / FCBGA-2104 | 2104-FCBGA(47.5×47.5) |
사양
부품 번호 정의
This industrial temperature low-power FPGA belongs to Xilinx Virtex UltraScale product family, fabricated on 20nm FinFET process technology. It integrates balanced programmable logic, high-density arithmetic units, abundant on-chip memory and high-speed serial transceivers, designed for power-limited rugged embedded devices, airborne payload systems, outdoor industrial signal processing equipment and military portable computing units requiring stable operation across the full industrial temperature range.
- XCVU125: Mid-capacity mainstream device of Virtex UltraScale series, equipped with complete high-speed interconnection architecture and well-proportioned overall hardware resources
- -1: Speed Grade 1, low-power optimized timing specification. It prioritizes power consumption reduction and thermal stability rather than peak clock frequency, perfectly suited for long-running devices with constrained heat dissipation space
- FLVB2104: 2104-ball flip-chip FCBGA compact package. The compact outline enables equipment miniaturization, while sufficient ball pins support full layout of all integrated transceivers, large-scale parallel signal wiring and multi-channel high-speed memory interface docking
- I: Industrial temperature grade, continuous junction temperature operating range: -40°C ~ +100°C
온칩 하드웨어 리소스 사양
1. Programmable Logic Resources
- Total System Logic Cells: 1567000
- Configurable CLB Slices: 89520
- Total Flip-Flops: 1790400
- Total LUT Lookup Tables: 895200
- Distributed RAM Capacity: 11.8 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic computing blocks: 1200 units, supports fixed-point and floating-point operations, large-scale FFT spectrum calculation, radar signal modulation and demodulation, cryptographic algorithm acceleration and medium-sized matrix computation tasks
- Total Block RAM Capacity: 44.3 Mb, applied for image frame buffering, deep FIFO data caching, waveform recording and algorithm parameter storage tables
No UltraRAM memory is embedded inside this chip
3. Clock Management Subsystem
- 14 MMCM clock management tiles
- 14 PLL phase-locked loops
Multiple mutually independent clock domains can be configured flexibly, supporting precise clock phase adjustment, signal transmission delay compensation and high-frequency jitter suppression, which fully satisfies strict synchronous timing requirements of complex large-scale digital systems
4. 고속 직렬 트랜시버
- 28 channels of GTH differential high-speed transceivers
Each lane achieves a maximum transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard Ethernet MAC IP cores greatly simplify the development of high-bandwidth network interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 928
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all commonly used single-ended and differential signal standards
The embedded system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals
Power Supply Characteristics
Nominal core operating voltage for Speed Grade 1 ranges from 0.92V to 0.98V. Logic fabric, block RAM, DSP arrays and serial transceivers adopt mutually isolated independent power domains, supporting partial module power shutdown to flexibly cut down total power consumption
Typical overall power consumption ranges from 15W to 48W. For continuous stable full-load operation under the upper industrial temperature limit, forced air cooling is required
Packaging and SMT Assembly Requirements
- Package form: 2104-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported inside anti-static trays to prevent electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
The chip can maintain long-term stable operation under drastic temperature fluctuations, mechanical shock, vibration and strong electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration, SEU single-event upset detection and correction, with optimized anti-radiation performance, applicable to aerospace onboard equipment, military rugged portable devices and outdoor industrial field deployment scenarios
일반적인 애플리케이션 시나리오
- Miniaturized airborne radar signal preprocessing boards, unmanned aerial vehicle payload data computing units
- Compact military VPX rugged embedded main control motherboards
- Portable high-precision spectrum analyzers and field arbitrary waveform signal generators
- Outdoor industrial multi-channel high-speed data acquisition and real-time signal processing systems
- Space-limited medium-scale ASIC prototype verification platforms
- Vehicular intelligent perception data fusion processing units and wide-temperature industrial edge gateways
