| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z035-2FFG676C | Zynq-7000 SoC | 42,98 | -2,00 | 275,000 LE | 17600000 | 0 | 1.0 V | SMD/SMT | 상업용(0°C ~ 85°C) | FCBGA-676 | FCBGA-676 |
사양
Part Number Parsing
This is Xilinx Zynq-7000 series all-programmable heterogeneous SoC fabricated on 28nm CMOS process. It integrates dual-core ARM Cortex-A9 processor subsystem and large-capacity Artix-7 FPGA logic resources, aimed at high-performance commercial embedded computing, multi-channel image processing and high-speed data acquisition systems.
- XC7Z035: Top-tier high logic density model within Zynq-7000 product line
- -2: Speed Grade 2, mainstream high-speed timing grade, ample timing margin for high-frequency logic design
- FFG676: 676-ball flip-chip FCBGA compact package
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
Full On-Chip Hardware Architecture
1. Processing System (PS: ARM Processor Domain)
- Dual-core ARM Cortex-A9 MPCore, maximum operating frequency up to 1000 MHz
- Each core owns independent 32KB instruction cache + 32KB data cache; 512KB shared L2 cache
- Built-in NEON SIMD floating-point acceleration unit for multimedia decoding, signal algorithm computing acceleration
- Comprehensive embedded peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, CAN bus, UART, SPI, I2C, general GPIO
- Secure boot function is supported to safeguard system startup security
2. Programmable Logic Fabric (PL: Artix-7 FPGA Section)
- Total Logic Cells: 277,760
- DSP48E1 dedicated arithmetic blocks: 900 units, deployed for FFT calculation, digital filtering, multi-channel image algorithm acceleration and medium-scale matrix operations
- Total Block RAM capacity: 17.0 Mbit
- Multiple MMCM + PLL clock management modules, capable of generating multi-group reference clocks and restraining clock jitter
- No on-chip embedded high-speed serial transceivers
3. I/O Resources & On-Chip Monitoring Unit
- Available configurable user I/O pins: 360
- I/O banks support adjustable voltage from 1.2V to 3.3V, compatible with LVCMOS, LVDS and other mainstream differential signal specifications
- Integrated dual-channel 12-bit XADC analog monitor: real-time sampling of chip internal temperature, each power supply voltage and external analog input signals
전원 공급 장치 사양
Nominal core logic operating voltage: 1.0 V
Independent power domains are assigned to the processing system and programmable logic respectively
Typical overall power consumption: 11 W ~ 30 W, heat sink cooling is required for long-term full-load running
포장 및 SMT 조립 요건
- Package form: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be finished within 168 hours after vacuum packaging is opened
- Lead-free packaging structure, fully compliant with RoHS environmental standards
- Packaged in anti-static trays for automated industrial PCB mass production
Environmental and Reliability Characteristics
Only applicable to indoor constant-temperature commercial and laboratory environments, not suitable for outdoor extreme high/low temperature industrial application scenarios.
It is equipped with bitstream encryption protection and SEU single-event upset detection functions, featuring stable long-term operation performance for indoor industrial automation equipment, commercial vision devices and desktop precision measurement instruments.
일반적인 애플리케이션 시나리오
- High-precision multi-axis industrial motion controllers, production line centralized control units
- Multi-camera synchronous industrial machine vision inspection platforms, high-speed image capture and processing terminals
- Multi-channel high-speed data recorders, vibration signal analysis and monitoring instruments
- Indoor medical diagnostic equipment main control modules and medical image preprocessing units
- Intelligent video surveillance multi-channel video decoding and edge analysis nodes
- High-performance embedded core boards and algorithm prototype verification platforms for secondary development
