| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc7z035-2ffg676c | Zynq-7000 SoC | 42,98 | -2,00 | 275,000 جنيه مصري | 17600000 | 0 | 1.0 V | SMD/SMT | تجاري (0 درجة مئوية ... 85 درجة مئوية) | FCBGA-676 | FCBGA-676 |
xc7z035-2ffg676c
الشركة المصنعة: زيلينكس
الخلايا المنطقية: ~28,000
ذاكرة الوصول العشوائي المدمجة (eRAM): ~1.0 Mb
عدد الإدخال/الإخراج: ~676 pins
الحزمة: FFG?676
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)
المواصفات
Part Number Parsing
This is Xilinx Zynq-7000 series all-programmable heterogeneous SoC fabricated on 28nm CMOS process. It integrates dual-core ARM Cortex-A9 processor subsystem and large-capacity Artix-7 FPGA logic resources, aimed at high-performance commercial embedded computing, multi-channel image processing and high-speed data acquisition systems.
- XC7Z035: Top-tier high logic density model within Zynq-7000 product line
- -2: Speed Grade 2, mainstream high-speed timing grade, ample timing margin for high-frequency logic design
- FFG676: 676-ball flip-chip FCBGA compact package
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
بنية أجهزة كاملة مدمجة على الرقاقة
1. Processing System (PS: ARM Processor Domain)
- Dual-core ARM Cortex-A9 MPCore, maximum operating frequency up to 1000 MHz
- Each core owns independent 32KB instruction cache + 32KB data cache; 512KB shared L2 cache
- Built-in NEON SIMD floating-point acceleration unit for multimedia decoding, signal algorithm computing acceleration
- Comprehensive embedded peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, CAN bus, UART, SPI, I2C, general GPIO
- Secure boot function is supported to safeguard system startup security
2. Programmable Logic Fabric (PL: Artix-7 FPGA Section)
- Total Logic Cells: 277,760
- DSP48E1 dedicated arithmetic blocks: 900 units, deployed for FFT calculation, digital filtering, multi-channel image algorithm acceleration and medium-scale matrix operations
- Total Block RAM capacity: 17.0 Mbit
- Multiple MMCM + PLL clock management modules, capable of generating multi-group reference clocks and restraining clock jitter
- No on-chip embedded high-speed serial transceivers
3. I/O Resources & On-Chip Monitoring Unit
- Available configurable user I/O pins: 360
- I/O banks support adjustable voltage from 1.2V to 3.3V, compatible with LVCMOS, LVDS and other mainstream differential signal specifications
- Integrated dual-channel 12-bit XADC analog monitor: real-time sampling of chip internal temperature, each power supply voltage and external analog input signals
مواصفات مصدر الطاقة
Nominal core logic operating voltage: 1.0 V
Independent power domains are assigned to the processing system and programmable logic respectively
Typical overall power consumption: 11 W ~ 30 W, heat sink cooling is required for long-term full-load running
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package form: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be finished within 168 hours after vacuum packaging is opened
- Lead-free packaging structure, fully compliant with RoHS environmental standards
- معبأة في صواني مقاومة للكهرباء الساكنة من أجل الإنتاج الصناعي الآلي للوحات الدوائر المطبوعة (PCB) بكميات كبيرة
Environmental and Reliability Characteristics
Only applicable to indoor constant-temperature commercial and laboratory environments, not suitable for outdoor extreme high/low temperature industrial application scenarios.
It is equipped with bitstream encryption protection and SEU single-event upset detection functions, featuring stable long-term operation performance for indoor industrial automation equipment, commercial vision devices and desktop precision measurement instruments.
سيناريوهات التطبيق النموذجية
- High-precision multi-axis industrial motion controllers, production line centralized control units
- Multi-camera synchronous industrial machine vision inspection platforms, high-speed image capture and processing terminals
- Multi-channel high-speed data recorders, vibration signal analysis and monitoring instruments
- Indoor medical diagnostic equipment main control modules and medical image preprocessing units
- Intelligent video surveillance multi-channel video decoding and edge analysis nodes
- High-performance embedded core boards and algorithm prototype verification platforms for secondary development
