XC5VFX30T-2FFG665C

제조업체: 자일링스
로직 셀: 30,720
로직 슬라이스: ~4,800
임베디드 RAM(eRAM): 2,506 Kb
패키지: FFG665 (Flip?Chip BGA)
작동 온도: 상업용(0°C ~ +85°C)

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC5VFX30T-2FFG665C Virtex-5 FXT 2.560,00 -2,00 32768 3276800 360 0.95 V–1.05 V 표면 실장 0 °C ~ +85 °C 665-FBGA, FCBGA 665-FCPBGA (27×27 mm)

    Xilinx XC5VFX30T-2FFG665C | Virtex-5 FXT High-Performance Embedded FPGA

    그리고 XC5VFX30T-2FFG665C is a high-speed, logic-integrated FPGA belonging to Xilinx’s premier Virtex-5 FXT platform. This device is specifically engineered for systems requiring the integration of a hard-core PowerPC® 440 processor and high-speed GTX serial transceivers in a space-efficient 665-pin package. With its 속도 등급 -2, it offers enhanced timing performance for critical data paths.

    에서 LXB 세미콘, we specialize in providing authentic, factory-sealed Xilinx silicon, supporting our customers with reliable inventory and technical expertise for their legacy and high-end industrial designs.

    Core Technical Specifications

    기능 Detailed Specification
    논리 셀 32,768
    속도 등급 -2 (High-Speed Grade)
    Embedded Processor 1 x PowerPC® 440 (Hard Core)
    RocketIO™ GTX 8 x Transceivers (up to 6.5 Gbps)
    DSP48E 슬라이스 64
    Total Block RAM 2,448 Kb
    패키지 FFG665 (Fine-Pitch BGA, Lead-Free/RoHS)
    작동 온도 0°C ~ 85°C (Commercial Grade)

    Key Advantages: Why Use the “-2” Speed Grade?

    For engineers, the XC5VFX30T-2FFG665C is more than just a standard FPGA. The “-2” specification provides a critical edge:

    1. Easier Timing Closure: The faster speed grade allows for higher frequency operation and more robust timing margins, which is essential for designs utilizing the full capacity of the 32,768 logic cells.

    2. Integrated CPU Performance: The hard-core PowerPC 440 subsystem operates more efficiently, allowing for deterministic control of complex hardware-software co-designs.

    3. Superior Serial Bandwidth: With 8 GTX transceivers, this chip handles high-speed protocols (PCIe, Serial RapidIO, SATA) with exceptional signal integrity.

    4. Advanced 65nm LUT-6 Architecture: Leveraging Xilinx’s second-generation 65nm technology, it reduces logic levels and path delays, significantly boosting system performance compared to earlier families.

    LXB Semicon: Authenticity & Trust 

    Sourcing high-end Virtex-5 series components requires a partner who understands the risks of the semiconductor market. LXB 세미콘 ensures your project’s success through:

    • 100% Genuine Guarantee: We exclusively supply original Xilinx (now AMD) silicon. No refurbished or “pull” parts.

    • Rigorous Quality Control: Each XC5VFX30T-2FFG665C undergoes multi-stage inspection in our ESD-safe facility, verifying marking, packaging integrity, and authenticity.

    • Legacy Stock Specialist: We bridge the gap for “hard-to-find” and mature series, ensuring your long-term production cycles are never interrupted.

    • Comprehensive Documentation: We provide full traceability, including Date Code (D/C) and Lot Code, to meet your internal quality standards.


    Frequently Asked Questions (FAQ)

    Q: Can the XC5VFX30T-2FFG665C be used instead of the -1 speed grade? A: Yes. The -2 grade is a high-performance version of the -1. It is fully backward-compatible and is a recommended upgrade to solve timing failures in existing designs.

    Q: Which design tools are required? A: This device is supported by 자일링스 ISE® 디자인 제품군 (Version 14.7 is the final stable release). Note: It is not compatible with Vivado®.

    Q: What is the benefit of the FFG665 package? A: The “G” indicates it is RoHS compliant and lead-free. The Flip-Chip BGA (FFG) package offers excellent thermal management and low-inductance connections.


    Request Pricing from LXB Semicon Today Looking for immediate stock or a bulk quote for the XC5VFX30T-2FFG665C? Contact our sales team for competitive pricing and professional support.