사양
MT41K256M16HA‑125 is Micron’s low-voltage DDR3L SDRAM (1.35V) for embedded, industrial, FPGA and automotive buffer designs, JEDEC DDR3 standard compliant.
Suffix Breakdown
- MT41K: Micron DDR3 / DDR3L SDRAM product line
- 256M16: Memory organization = 256M × 16-bit wide data bus
- HA: Die revision, 96-ball TFBGA package variant
- 125: Timing grade (tCK=1.25ns, 800MHz clock, DDR3L-1600 / PC3L-12800)
- Suffix suffix codes:
- V: Commercial temp (0°C ~ +85°C), tray packaging (MT41K256M16HA‑125V:E)
- IT: Industrial extended temp (-40°C ~ +95°C)
- TR: Tape-and-reel automated SMT reel shipment
1. Core Memory Architecture
Density & Bank Layout
- Total capacity: 4Gb = 512MB physical storage
- Organization: 268,435,456 words × 16-bit data width
- 8 independent internal memory banks for parallel read/write scheduling
- 8n prefetch DDR3 architecture, double data rate on both rising/falling clock edges
- Configurable burst modes: Fixed BL8 (burst length 8) + BC4 burst chop 4 (switchable OTF via mode register)
- 8192 auto-refresh cycles within 64ms window (0~85°C); 32ms refresh for high temp up to 95°C
Timing & Speed Specs
- Internal clock frequency: 800 MHz, data transfer rate 1600 MT/s
- Minimum clock cycle tCK = 1.25 ns
- Programmable CAS latency CL6 / CL7 / CL8 / CL9 via MRS mode register
- Supports additive latency AL and write latency CWL tuning for PCB signal matching
- Write leveling feature to compensate PCB trace skew on high-speed differential strobes
2. Electrical Interface Characteristics
- Nominal supply VDD / VDDQ: 1.35V DDR3L low voltage (operating range: 1.283V ~ 1.45V)
- Backward compatible with standard 1.5V DDR3 power rail for mixed voltage legacy systems
- Differential CK/CK# clock pair + differential bidirectional DQS/DQS# data strobes for high noise rejection
- Integrated On-Die Termination (ODT): Dynamic / fixed programmable 50/75/150Ω termination to eliminate external series resistors
- DQM byte mask pins for independent high/low 8-bit partial writes on 16-bit bus
- Low power modes: Power-down, precharge standby, auto self-refresh (ASR) with SRT self-refresh temperature adjustment for battery-powered equipment
3. Reliability & Compliance
- Moisture Sensitivity Level MSL3 (168-hour floor life before reflow soldering)
- Fully RoHS 3 lead-free, halogen-free and REACH SVHC compliant
- High ESD and latch-up immunity for industrial wiring harsh EMI environments
- Multi-purpose mode register for drive strength, termination, latency and refresh configuration
- Automatic self-refresh (ASR) maintains data integrity under wide temperature swings
4. 패키지 사양
- Package type: 96-ball thin FBGA (TFBGA) surface mount
- Package dimension: 14 mm × 9 mm × 1.2 mm ultra-thin profile
- Ball pitch: 0.8 mm fine pitch for compact dense PCB layouts
- Standard tray bulk packaging; tape-and-reel reel version (‑TR) for mass automated SMT assembly
일반적인 애플리케이션
- Industrial PLC, servo motion control, CNC machine embedded working memory
- FPGA/SoC industrial gateway, network switch, vision image frame buffer
- Automotive infotainment, instrument cluster and cabin ECU low-power RAM
- Medical portable diagnostic instruments, real-time signal data buffering
- Digital signage, POS payment terminal, handheld test & measurement equipment
- Embedded Linux single-board computers, battery-powered IoT edge nodes
- Audio DSP, MIDI equipment and portable multimedia player main memory
LXB Semicon supplies original Micron MT41K256M16HA‑125 commercial / industrial grade 512MB x16 DDR3L-1600 SDRAM memory IC
