XC4VSX35-10FFG668C

Fabricante: AMD / Xilinx
Células lógicas: 34,560
Rebanadas lógicas: 3,840
RAM integrada (eRAM): 3.456.000 bits
Paquete: FFG668 (27×27 mm)
Temperatura de funcionamiento: 0°C a +85°C (Comercial)

ENVÍANOS UN MENSAJE

    Especificaciones

    MODELO P/NSERIENÚMERO DE LABORATORIOS/CLBSGRADO DE VELOCIDADNÚMERO DE ELEMENTOS LÓGICOS / CELDASTOTAL BITS RAMNÚMERO DE E/STENSIÓN - ALIMENTACIÓNTIPO DE MONTAJETEMPERATURA DE FUNCIONAMIENTOPAQUETE / ESTUCHEPAQUETE DEL DISPOSITIVO DEL PROVEEDOR
    XC4VSX35-10FFG668CVirtex-4 SX3.840,000,0034560 Elementos lógicos3.538.944 bits4481,14 V ~ 1,26 VMontaje en superficieComercial (0°C ~ +85°C)668-BBGA, FCBGA668-FCBGA (27×27)

    XC4VSX35-10FFG668C: Virtex-4 SX Optimized for Digital Signal Processing

    En XC4VSX35-10FFG668C remains a cornerstone for high-performance DSP applications within the Xilinx Virtex-4 family. Specifically engineered for signal processing-intensive workloads, the SX sub-family provides a significantly higher ratio of DSP48 slices compared to the LX or FX variants.

    Technical Breakdown & Core Specifications

    The “SX” designation is the critical factor here. While the LX focuses on logic density, the SX35 is built for arithmetic heavy-lifting.

    • Células lógicas: 34,560

    • DSP48 Slices: 192 (The primary advantage for filter design and FFTs)

    • Block RAM: 3,456 Kb

    • Maximum User I/O: 448

    • Paquete: FFG668 (Fine-pitch Flip-Chip BGA, Lead-Free/RoHS compliant)

    • Grado de velocidad: -10

    • Temperature Grade: Commercial (0°C to 85°C)

    Why Sourcing This Part Matters Now

    In the current market, the XC4VSX35-10FFG668C is often utilized in Form, Fit, and Function (FFF) replacements for aging defense and telecommunications hardware. We understand that for these applications, “New/Clean” date codes and verifiable CoC (Certificate of Conformance) documentation are more important than price.

    📩 Póngase en contacto con LXB Semicon for availability, pricing, and technical support.